ATS-10B-168-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.94°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

Thermal heat sinks are metal structures used to dissipate heat from electronic components. Heat sinks provide a large surface area for cooling, thus allowing heat to dissipate at a faster rate than from a single point source. The ATS-10B-168-C1-R0 is a thermal heat sink that is designed to dissipate the heat generated by various electronic components.

Design

The ATS-10B-168-C1-R0 is a durable, high-performance heat sink constructed with an aluminum extrusion. The extrusion is then CNC machined to create fins with a high surface area to increase overall cooling. It comes with mounting holes and clamps for secure mounting, as well as thermal washers for greater heat transfer. The heat sink is also equipped with an internal "thermal fuse" that will shut down if the temperature reaches an unsafe level for the application.

Application Field

The ATS-10B-168-C1-R0 is ideal for use in a variety of applications ranging from industrial to consumer electronics. It is suited for use with a variety of components such as voltage regulators, power amplifiers, power converters, and microprocessors. It is also suitable for use with power semiconductor components such as diodes, transistors, and thyristors. The heat sink can be used in communication and networking equipment, medical devices, and in consumer electronics including televisions, DVD players, and game consoles.

Working Principle

The ATS-10B-168-C1-R0 works by dissipating heat from the components it is mounted on. To do this, the heat sink actively draws heat away from the components through conduction. Heat is absorbed by the fins of the heat sink and dissipated into the air. The heat sink also relies on convection to move hot air away from the component and out of the device. The air is then replaced by cooler air though the use of fans or natural air convection. This process helps to keep the overall temperature of the device and the components within a safe operating range.

Conclusion

The ATS-10B-168-C1-R0 is a highly versatile thermal heat sink designed to dissipate heat from a variety of electronic components. The design features a large surface area to increase cooling, along with mounting holes and clamps for secure mounting. It is suitable for use in a variety of applications from industrial to consumer, and can be used in communication and networking equipment, medical devices, and consumer electronics. The heat sink relies on both conduction and convection to move heat away from the components and out of the device to keep the overall temperature within a safe range.

The specific data is subject to PDF, and the above content is for reference