| Allicdata Part #: | ATS17182-ND |
| Manufacturer Part#: |
ATS-10B-170-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10B-170-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks have become commonplace in many products in recent years, and they are used in a variety of applications. The ATS-10B-170-C2-R0 Heat Sink is designed to address a range of challenges in the thermal management of electronic components. This article looks at the applications and working principles of this heat sink in greater detail.
Applications
The ATS-10B-170-C2-R0 Heat Sink is designed for use in a wide array of applications. It can be used in commercial or industrial electronics solutions, such as circuit boards, computers, and telecommunication devices. It is also suitable for industrial and consumer electronics, such as audio and video devices and telecommunications devices. In addition, the heat sink is designed for use in medical instruments, laser systems, and scientific instruments.
This heat sink is constructed from aluminum and is anodized for greater durability and corrosion resistance. It has a unique fin design that enables it to dissipate heat more efficiently than traditional heat sinks. It also has a thermally stable base for consistent cooling performance. Finally, it can handle temperatures up to 180°C to ensure reliable operation in a variety of environments.
Working Principle
The ATS-10B-170-C2-R0 Heat Sink has several features that allow it to be superior at transferring heat away from sensitive components. The heat sink is made using anodized aluminum and has a thick base that makes contact with the component that needs to be cooled. This base is thermally stable and helps to evenly dissipate heat to the whole sink. The heat sink also has thin fins that act as thermal conductors to dissipate heat away from the base.
The fins are designed in such a way that they effectively dissipate heat away through radiation. The fins also facilitate air flow via convection. The heat sink facilitates heat transfer through a process known as “heat pumping”. This process uses the natural convection of the air to move the heated air away from the sink. Heat pumping is more efficient than conduction or convection alone, as it is able to more effectively bring cooler air to the sink and remove heated air.
The ATS-10B-170-C2-R0 Heat Sink is designed for applications where high-temperature performance is a necessity. It is effective for cooling electrical components up to temperatures of 180°C. The unique design ensures efficient heat transfer and reliable operation in even the most demanding conditions.
Conclusion
The ATS-10B-170-C2-R0 Heat Sink is an effective and efficient way to address the thermal management needs for many electronic components. Its anodized aluminum construction and unique fin design facilitates air flow for efficient heat transfer. It is suitable for a wide range of applications, and is capable of coolcing components up to temperatures of 180°C. The ATS-10B-170-C2-R0 Heat Sink is an excellent solution for any application that requires reliable thermal management.
The specific data is subject to PDF, and the above content is for reference