| Allicdata Part #: | ATS-10B-178-C3-R0-ND |
| Manufacturer Part#: |
ATS-10B-178-C3-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10B-178-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-10B-178-C3-R0 thermal-heat sinks are utilized for controlling temperature in electronic components. Through heat conduction, the heat generated is dissipated quickly and efficiently from the component and surroundings. These heat sinks are designed to be lightweight and slim, providing an ideal solution for portable and high-performance designs. The device features a slim design with thin fins, allowing for easy installation in narrow or confined spaces. The ATS-10B-178-C3-R0 is constructed using an aluminum base and fin assembly and utilizes thermal transfer planes that help evenly disperse the heat energy throughout the device. The aluminum material ensures maximum heat transfer and insulation properties, resulting in superior cooling performance. The fins are arranged in vertical rows and the heat sink is designed with a flat profile for enhanced efficiency. The heat dissipation of the ATS-10B-178-C3-R0 is driven by convection, making it suitable for use in air-cooling applications. Its bottom side has a flat surface which allows for easy mounting with mechanical fasteners. Its versatile design makes it ideal for use in both light and heavy-duty applications. The ATS-10B-178-C3-R0 thermal-heat sink is capable of providing superior cooling performance thanks to its optimized design and slim profile. It minimizes power dissipation losses by keeping the thermal transfer from the device low. Moreover, its slim design allows for a compact form factor, enabling the device to be used in numerous applications. The device also features a high flow capability and excellent thermal conduction. The thermal-transfer planes have high-quality connectors that are robust and reliable. Additionally, the control of the thermal transfer is fine-tuned via the use of thermal paste or adhesive tape. In summary, the ATS-10B-178-C3-R0 is a slim and lightweight thermal-heat sink solution that provides superior cooling properties and optimized performance. Its construction consists of an aluminum base and fin assembly with a flat profile which aids in the efficient heat dissipation. Due to its slim design, the device is suitable for a variety of applications and is capable of providing a compact form factor. Furthermore, its high flow capacity and excellent thermal conduction ensure high-performance cooling.
The specific data is subject to PDF, and the above content is for reference