ATS-10B-197-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-10B-197-C3-R0-ND

Manufacturer Part#:

ATS-10B-197-C3-R0

Price: $ 3.51
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10B-197-C3-R0 datasheetATS-10B-197-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.18591
30 +: $ 3.09981
50 +: $ 2.92774
100 +: $ 2.75549
250 +: $ 2.58325
500 +: $ 2.49714
1000 +: $ 2.23882
Stock 1000Can Ship Immediately
$ 3.51
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.05°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

The ATS-10B-197-C3-R0 is a type of heat sink used to protect some electronic components from overheating. This type of heat sink is made from aluminum and is designed to improve heat dissipation in various electrical applications by transferring heat away from the components. It also helps protect the components from heat damage and reduces the need for additional cooling by allowing airflow around the components.

The ATS-10B-197-C3-R0 is made of aluminum and is designed to provide superior cooling performance compared to many other types of heat sinks. It has a finned aluminum design, which allows for improved air circulation and heat distribution. The ATS-10B-197-C3-R0 has a large surface area and a high rate of heat transfer, making it ideal for applications where heat dissipation is a concern. It also has a low profile, which makes it suitable for use in many tight spaces.

The ATS-10B-197-C3-R0 is a commonly used heat sink type in many commercial applications, such as computers, automotive electronics, telecoms, and consumer products. It is used in applications requiring a high level of cooling performance, such as laser diodes and high-power processors. The heat sink is also used to cool sensitive components such as microprocessors and memory chips. It can provide an effective cooling solution for components in a wide range of operating temperatures.

The ATS-10B-197-C3-R0 is designed to transfer heat away from the component to a larger area, such as an external radiator or a larger heat sink. This type of heat sink works by directing heat away from the component using a process known as thermal conduction. The heat sink\'s fins serve as a barrier to stop the heat from radiating back to the component. By transferring heat away from the component, the ATS-10B-197-C3-R0 is able to protect the component from overheating.

The ATS-10B-197-C3-R0 offers several advantages over other types of heat sinks. It is lightweight, yet is designed to offer high levels of cooling performance. It has a low profile, making it suitable for use in a variety of applications. Because of its finned aluminum design, it also offers improved air circulation and heat distribution. Lastly, it is corrosion-resistant and easy to install.

In conclusion, the ATS-10B-197-C3-R0 is a type of heat sink designed to provide superior cooling performance in many commercial and consumer applications. It is made of aluminum and is designed for improved heat dissipation. It has a finned aluminum design to provide improved air circulation and heat distribution. The ATS-10B-197-C3-R0 also has many advantages, including low profile, lightweight, corrosion-resistant, and easy installation.

The specific data is subject to PDF, and the above content is for reference

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