Allicdata Part #: | ATS-10B-20-C3-R0-ND |
Manufacturer Part#: |
ATS-10B-20-C3-R0 |
Price: | $ 4.67 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 54X54X25MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-10B-20-C3-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 4.19895 |
30 +: | $ 3.96543 |
50 +: | $ 3.73225 |
100 +: | $ 3.49896 |
250 +: | $ 3.26570 |
500 +: | $ 3.03243 |
1000 +: | $ 2.97412 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.126" (54.01mm) |
Width: | 2.126" (54.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Thermal management is a main concern for many industries, as it is essential to ensure that electronic components and machines do not suffer from excessive heat. Fortunately, there are many different kinds of technology that can be used to cool down various components, including the ATS-10B-20-C3-R0 heat sink. This type of heat sink has been designed to provide the best thermal management possible in a wide range of applications. This article will provide an overview of the applications and working principles of the ATS-10B-20-C3-R0 heat sink.
The ATS-10B-20-C3-R0 is an aluminum heat sink designed to provide efficient cooling in limited spaces. It is an ideal choice for applications that require high heat dissipation, such as consumer electronics, computers, power management systems, and industrial machinery. The heat sink is composed of a base plate and fins, which together create a surface area that provides increased thermal dissipation. By increasing the surface area, the ATS-10B-20-C3-R0 is able to transfer heat away from sensitive parts and other electronic components.}
The ATS-10B-20-C3-R0 heat sink is composed of three main parts: the base plate, the heat dissipating fins, and the aluminum frame. The base plate is a flat, heat-conductive surface that is connected to the aluminum frame. The fins attached to the base plate help to increase the surface area of the heat sink, thus increasing the amount of heat that can be dissipated. The aluminum frame further increases the heat dissipation capability of the heat sink by providing an additional surface that dissipates heat by convection.
The ATS-10B-20-C3-R0 heat sink has a few primary working principles. The first of these is the law of thermodynamics, which states that heat flows from areas of higher temperature to areas of lower temperature. This means that the heat generated by the device or component will be transferred to the heat sink through the base plate, the frame, and the fins. The heat sink will then dissipate this heat by convection or radiation.
The ATS-10B-20-C3-R0 heat sink also takes advantage of natural convection. Natural convection occurs when hot air rises and cooler air falls, and is a result of differences in air density. The rising hot air is exchanged for cooler air, resulting in heat transfer to the sink. This process is referred to as conduction, and is the primary mode of thermal management used by the ATS-10B-20-C3-R0 heat sink.
The ATS-10B-20-C3-R0 heat sink is a highly efficient device for providing thermal management. Its design allows for optimal heat dissipation in a wide variety of environments. Its use is ideal in applications that require both high heat dissipation and limited space. Its ability to provide efficient cooling while taking up minimal space makes it an ideal choice for many different industries. These include consumer electronics, power management systems, computers, and industrial machinery.
The specific data is subject to PDF, and the above content is for reference