| Allicdata Part #: | ATS-10B-210-C3-R0-ND |
| Manufacturer Part#: |
ATS-10B-210-C3-R0 |
| Price: | $ 6.57 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10B-210-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.91066 |
| 30 +: | $ 5.58222 |
| 50 +: | $ 5.25395 |
| 100 +: | $ 4.92553 |
| 250 +: | $ 4.59716 |
| 500 +: | $ 4.26879 |
| 1000 +: | $ 4.18670 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-10B-210-C3-R0 Application Field and Working Principle
Heat sinks are used to efficiently manage thermal energy. Heat is generated by modern components such as processors and other circuit components during the operation and needs to be removed efficiently. Heat sinks are one of the best solutions available to help manage thermal energy generated by components in order to maintain a safe temperature level and ensure an optimal performance level. ATS-10B-210-C3-R0 is a heat sink designed to efficiently transfer thermal energy away from components.
The application field of the ATS-10B-210-C3-R0 heat sink is mainly related to processors, which is an important component in many electronic devices. The heat sink is designed to effectively absorb and transfer thermal energy away from the processor while dissipating it into the environment. It is designed to support various types of processors, including Intel and AMD, so it can be used on a variety of devices.
The ATS-10B-210-C3-R0 heat sink uses passive cooling to help disperse thermal energy. The design of the heat sink is based on the natural force of convection. Heat is conducted through the fins of the heat sink, allowing the thermal energy to transfer successfully away from the component. The thermal energy is then replaced by air flowing in from the sides of the fins and through the use of a fan which provides additional airflow on the surface of the heat sink. This process is known as air convection and is one of the most effective methods for dissipating thermal energy.
The ATS-10B-210-C3-R0 heat sink has a number of advantages. The design of the heatsink provides a high-efficiency cooling performance which helps to reduce the temperature of the processor and ensure that it runs at its optimal performance level. The passive cooling process ensures that no additional power is required to operate the heat sink, further reducing the carbon footprint. The high-density design of the heat sink also helps to reduce the size of the overall unit, making it an ideal choice for applications where size and weight savings are important.
In conclusion, the ATS-10B-210-C3-R0 heat sink is an effective thermal management solution for modern processors. The efficient design of the heat sink is based on the natural force of convection to help disperse the thermal energy of the processor to the environment. The high-efficiency cooling performance helps to reduce the temperature of the processor and ensure that it runs at its optimal performance level. Additionally, the passive cooling process used ensures that no additional power is required and the high-density design helps to reduce the size of the overall unit. As such, the ATS-10B-210-C3-R0 heat sink is an excellent choice for thermal management applications.
The specific data is subject to PDF, and the above content is for reference