| Allicdata Part #: | ATS-10B-26-C3-R0-ND |
| Manufacturer Part#: |
ATS-10B-26-C3-R0 |
| Price: | $ 6.90 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10B-26-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.21117 |
| 30 +: | $ 5.86635 |
| 50 +: | $ 5.52119 |
| 100 +: | $ 5.17614 |
| 250 +: | $ 4.83106 |
| 500 +: | $ 4.48599 |
| 1000 +: | $ 4.39972 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electrical components requires the removal of the heat generated by them. The power dissipated by components is associated with the current and voltage and also depends on the environment. In order to protect the electronic equipment, thermal management systems must be used to dissipate this heat. Heat sinks are commonly used to help dissipate the heat from the components.
ATS-10B-26-C3-R0 is an aluminum alloy heat sink with a 2.5mm thick base. It is capable of dissipating heat from an array of electrical components, including those from a wide range of switching applications. Its U-shape design and two radiating fins significantly enhance heat dissipation performance. Its excellent mechanical properties, low cost, and light weight make it an ideal choice for a variety of thermal management applications.
ATS-10B-26-C3-R0 has several key features. The U-shape design allows for high performance heat dissipation. The two radiating fins, along with the large surface area, promote effective stray heat removal from the component being cooled. Its lightweight construction allows for easy installation and replacement. Additionally, the anodized finish provides a corrosion-resistant coating, making the heat sink durable and long-lasting.
In order to maximize the thermal performance of the heat sink, it is important to properly mount it on the component being cooled. The base of the ATS-10B-26-C3-R0 should be in direct contact with the component. Then, thermal grease should be applied between the heat sink and the component in order to promote effective heat transfer from the component to the heat sink. The heat sink should then be secured in place with fasteners. Once the heat sink is properly mounted, the air flow should be directed over the fins in order to maximize the heat transfer.
In order to efficiently manage thermal loads, ATS-10B-26-C3-R0 should be considered as an option for thermal management. Its design and features make it ideal for dissipating heat from a range of components including those in switching applications. It also provides durable performance due to its anodized finish. Although this heat sink is lightweight and easy to install, it is important to ensure that it is properly mounted on the component in order to maximize its thermal performance.
The specific data is subject to PDF, and the above content is for reference