| Allicdata Part #: | ATS-10B-33-C3-R0-ND |
| Manufacturer Part#: |
ATS-10B-33-C3-R0 |
| Price: | $ 5.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X17.78MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10B-33-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.23971 |
| 30 +: | $ 4.94865 |
| 50 +: | $ 4.65759 |
| 100 +: | $ 4.36647 |
| 250 +: | $ 4.07537 |
| 500 +: | $ 3.78427 |
| 1000 +: | $ 3.71150 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an integral component in a vast range of industries and applications. The ATS-10B-33-C3-R0 Heat Sink is a versatile and cost-effective solution for the thermal management of electronic components and systems.
The ATS-10B-33-C3-R0 Heat Sink is designed for passive cooling of domestic and commercial applications, including microprocessors, power supplies and other components in enclosed and open systems. It features a large heresite aluminum core with a series of stainless steel fins. This design maximizes surface area to improve airflow and dissipate heat effectively. The heat sink also stands out from the competition with its compact size, low profile, and light weight design, allowing for easy installation and maintenance.
The ATS-10B-33-C3-R0 Heat Sink operates according to the principles of thermal management. At the heart of this process lies a transfer of heat. In a thermal management system, heat is transferred through various paths depending on the materials and surface properties of the system components. In the ATS-10B-33-C3-R0 Heat Sink, the aluminum core and stainless steel fins act as heat conductors, allowing heat to move from the source components to the fins and then dissipate into the environment.
The ATS-10B-33-C3-R0 Heat Sink is well-suited for applications such as power supplies, power controllers, and processors which require efficient cooling in enclosed systems. It features a highly effective aluminum-fintechnology which reduces additional airflow requirement to ensure efficient thermal management. The lightweight and compact design further enhances the ease of installation and use.
The ATS-10B-33-C3-R0 Heat Sink also offers anti-corrosion and anti-electricity protection features to ensure long-term reliability and performance. Additionally, it has passed EMC (ElectroMagnetic Compatibility) testing to demonstrate it meets the essential requirements of the directive for low voltage applications.
In summary, the ATS-10B-33-C3-R0 Heat Sink is an ideal choice for thermal management in a range of electronic components and systems. It offers efficient heat conduction and dissipation, a compact size, and is easy to install and maintain. It also offers strong safety features to reduce the risk of corrosion or electrical damage. As such, the ATS-10B-33-C3-R0 Heat Sink is an excellent choice for thermal management in many applications.
The specific data is subject to PDF, and the above content is for reference