| Allicdata Part #: | ATS-10B-46-C3-R0-ND |
| Manufacturer Part#: |
ATS-10B-46-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10B-46-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
。The ATS-10B-46-C3-R0 thermal heat sink is designed to dissipate heat from a variety of electronic components. It does this by creating a thermal bridge between the component and the surrounding environment, so the heat is transferred away from the component and dispersed into the atmosphere. This allows the component to remain relatively cool, even when subjected to high levels of thermal stress. The thermal heat sink is composed of several components, including a metal base, radial fins, and thermal paste.
The metal base is designed to have a tight fit with the electronic component it is dissipating heat from. It is paramount that the base is properly aligned and securely mounted so that heat is able to be transferred from the component to the heat sink efficiently. This is important to ensure that the component does not overheat and ruin itself, or even worse, start a fire.
The radial fins on the thermal heat sink work in conjunction with the metal base to provide a larger surface area for heat transfer. These fins increase the surface area of the heat sink by spreading it out over a larger area. This subsequently increases the rate at which the heat can be transferred away from the component and into the atmosphere. The number of fins and their layout can be adjusted to optimize the heat transfer rate.
To further increase the heat transfer rate and efficiency, thermal paste is often applied between the metal base and the electronic component. This paste is made from metal particles suspended in a thermally conductive base, allowing it to transfer heat quickly to the metal base of the heat sink. The thermal paste is also temperature and pressure resistant, so it won’t break down over time due to extreme temperatures or high stress.
Overall, the ATS-10B-46-C3-R0 thermal heat sink is designed to efficiently transfer heat away from an electronic component and disperse it into the atmosphere. This helps keep the component cool, even when subjected to high levels of thermal stress. The metal base, radial fins, and thermal paste work together to create a thermal bridge between the component and the surrounding environment, allowing heat to be transferred away from the component quickly and efficiently. It is a great solution for any situation in which an electronic component needs to be kept cool without sacrificing performance.
The specific data is subject to PDF, and the above content is for reference