| Allicdata Part #: | ATS-10B-55-C1-R0-ND |
| Manufacturer Part#: |
ATS-10B-55-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-10B-55-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 23.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-10B-55-C1-R0 is a thermal heat sink designed for optimal heat dissipation to support a variety of applications. Heat sinks are widely used in a variety of different industries and applications, for example, computers, TV’s, refrigerators, air conditioners, etc. ATS-10B-55-C1-R0 is able to effectively manage and dissipate heat produced by electronics and ensure that they operate within their intended operating range for a prolonged period of time.
Thermal heat sinks are composed of a robust alloy of aluminum and copper, making them highly durable and effective for dissipating heat. They come in a variety of shapes and sizes and can be tailored to fit specific applications and needs. The ATS-10B-55-C1-R0 heat sink measures 55×55 mm, making it ideal for compact sized electronics and applications that lack room for larger heat sinks. The fins on top and bottom of the heat sink are designed to increase the surface area contact while enabling optimal heat dissipation.
The ATS-10B-55-C1-R0 features an optimal high-air-flow design with excellent heat exchanging properties. The heat sink also has a low mounting depth which allows for more space to be saved. This results in a more efficient system, allowing the heat sink to better manage and transfer heat away from any component. The heat sink is also fitted with mounting holes that provide secure mounting solutions when installing the heat sink.
The ATS-10B-55-C1-R0 has multiple working principles behind its heat dissipation and air passage distributions. Heat sinks have a natural ability to dissipate heat conducted from the heat-producing component to its surroundings in the form of air flow. This is done by optimizing the air flow passage between the heat source and the components around it. This is achieved by creating a large enough airway in order to enable effective heat exchange. The hot air produced by the heat-generating component is drawn away by the fan, allowing the heat sink to efficiently release the heat away from the components.
Heat sinks also dissipate heat by way of a combination of convection and radiation. Convection is the transfer of heat through the movement of fluids, and radiation is the transfer of energy from an object. The fins on the heat sink increase the surface area which increases the amount of heat that can be transferred away from the components. Heat sinks also allow air to circulate around the components, allowing the heat sink to dissipate heat more efficiently.
Overall, the ATS-10B-55-C1-R0 thermal heat sink provides an optimal solution for efficient heat dissipation. By utilizing an array of innovative techniques, the heat sink is able to effectively manage and dissipate heat in a timely and efficient manner. This allows the heat sink to ensure the safe operation of components, and the prolonged lifespan of spaces and systems that require heat management.
The specific data is subject to PDF, and the above content is for reference
ATS-10B-55-C1-R0 Datasheet/PDF