| Allicdata Part #: | ATS-10B-55-C3-R0-ND |
| Manufacturer Part#: |
ATS-10B-55-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10B-55-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 24.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are one of the most important components of any electronic system. The ATS-10B-55-C3-R0 is a type of thermal-heat sink that can help ensure an efficient and reliable system operation.
This thermal-heat sink uses differential pressure and dielectric coatings to dissipate heat generated from components it is connected to. Heat transfer occurs between a component and the sink due to the differential pressure. The design of the ATS-10B-55-C3-R0 can effectively reduce the thermal resistance of the contact area between the two surfaces, thus ensuring efficient heat dissipation.
The ATS-10B-55-C3-R0 is composed of a high-performance thermal base metal and anodized aluminium fins for maximum heat sink performance. The structure of the fins is designed to maximize the surface area. As such, the ATS-10B-55-C3-R0 will also have a larger thermal capacity, allowing it to dissipate more heat than traditional heat sinks.
The ATS-10B-55-C3-R0 thermal-heat sink has a wide range of applications. It is a commonly used component in industrial processes, consumer electronics, and automotive systems. It is also widely used in computers, game consoles, and other electronic devices. Its efficient heat dissipation capability makes it ideal for use in high-power devices.
The ATS-10B-55-C3-R0 thermal-heat sink is a reliable and highly efficient component. It is designed to minimize the thermal resistance of the contact points and dissipate as much heat as possible. The design of the fins helps to increase the surface area, allowing the heat sink to absorb more heat and use it to dissipate more. The heat sink is also designed to be durable and reliable, ensuring a long service life.
The ATS-10B-55-C3-R0 thermal-heat sink is a great addition to any electronic system. It is designed to maximize heat dissipation and keep components operating at optimal levels. This allows the system to remain reliable and efficient, ensuring that the system will run smoothly and reliably. The ATS-10B-55-C3-R0 thermal-heat sink is also highly durable and reliable, making it ideal for use in a wide range of applications.
The specific data is subject to PDF, and the above content is for reference