| Allicdata Part #: | ATS17260-ND |
| Manufacturer Part#: |
ATS-10B-67-C2-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10B-67-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.93750 |
| 10 +: | $ 3.82851 |
| 25 +: | $ 3.61595 |
| 50 +: | $ 3.40326 |
| 100 +: | $ 3.19051 |
| 250 +: | $ 2.97781 |
| 500 +: | $ 2.76511 |
| 1000 +: | $ 2.71193 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions like ATS-10B-67-C2-R0 have become increasingly popular in a variety of industries. This solution effectively manages heat generated from electric and electronic components in order to ensure the components perform at their optimum level.
The ATS-10B-67-C2-R0 is a type of heat sink designed and manufactured by Advanced Thermal Solutions (ATS). Heat sinks are widely used in the electronics industry as a form of passive cooling technology. By transferring heat away from the source, heat sinks allow components to run cooler and more efficiently.
The ATS-10B-67-C2-R0 is an aluminum-based heat sink designed for heavy-duty applications in industrial, automotive, and consumer electronics. The heatsink is designed to dissipate large volumes of heat with minimal surface area. Its product features include a large fin area and direct-contact heatpipe technology. Additionally, the fanless design allows for silent operation in tight spaces.
The ATS-10B-67-C2-R0 operates using a thermal conduction process. This process works by using a cooler heatsink surface to draw heat away from the component and release it into the atmosphere. It is designed to facilitate rapid transfer of heat energy between the component and the heatsink with minimal thermal resistance and maximum efficiency.
Within the ATS-10B-67-C2-R0, a system of fins distributes heat away from the main body of the heatsink. Airflows travelling through the fins act as a cooling agent, dissipating heat away from the components and creating lower temperatures. The fins are designed to be large enough to allow for efficient conduction of heat and at the same time allow for maximum airflow to reduce temperatures at the component and the heatsink.
The ATS-10B-67-C2-R0 also utilizes a direct-contact heatpipe technology. Heatpipes are thin tubes of metal filled with a heat transfer liquid. As the heatpipe absorbs heat, the liquid vaporizes and expands, allowing it to carry heat away from the component. As it cools down, it condenses back to liquid and gravity pulls it back to the component to be re-heated. This process creates a continuous loop and acts as an efficient transfer of heat energy from the source to the heatsink.
The ATS-10B-67-C2-R0 is a reliable solution for controlling temperatures in heavy-duty applications. It is designed to dissipate large volumes of heat with minimal surface area, allowing for efficient conduction of heat energy. Combining direct-contact heatpipe technology with an efficient airflow system, the heatsink is able to effectively manage temperatures and keep components running at peak performance.
The specific data is subject to PDF, and the above content is for reference