ATS-10B-82-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-10B-82-C3-R0-ND

Manufacturer Part#:

ATS-10B-82-C3-R0

Price: $ 3.72
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X25MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10B-82-C3-R0 datasheetATS-10B-82-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.37617
30 +: $ 3.28503
50 +: $ 3.10250
100 +: $ 2.91999
250 +: $ 2.73748
500 +: $ 2.64622
1000 +: $ 2.37248
Stock 1000Can Ship Immediately
$ 3.72
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.97°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal–heat sinks, such as the ATS-10B-82-C3-R0, are important components for many applications. They are used to dissipate heat from electrical devices, such as CPUs, transistors, and other thermally sensitive components. By dissipating the heat, they help to prevent the components from overheating, which can damage them or cause them to malfunction.

The ATS-10B-82-C3-R0 is an example of a thermal–heat sink that is designed to be mounted directly to the device or component it is being used to protect. It is a two-piece design, with the upper and lower parts joined together by three screws. The upper part consists of an aluminum heat sink, which is designed to draw heat away from the device or component it is used to protect. The lower part consists of a thermal fin assembly, which is designed to increase the surface area in contact with the air, and thus provide greater cooling.

The working principle behind the ATS-10B-82-C3-R0 is simple. When the device or component generates excess heat, it is transferred to the aluminum heat sink, which then dissipates it into the air. The thermal fin assembly helps to increase the surface area and contact with the air, allowing for even more efficient heat dissipation.

The ATS-10B-82-C3-R0 is suitable for a wide range of applications, such as CPUs, processors, transistors, and other thermally sensitive components. It can be used in computers, servers, networking equipment, industrial equipment, and other electronic devices. It is also helpful to protect against environmental conditions such as humidity and dust, as these can also cause a buildup of heat.

The ATS-10B-82-C3-R0 is also designed for easy installation and maintenance. It comes with a bracket that can be mounted directly to the device or component it is protecting, and all necessary hardware is included. It is also lightweight and compact, making it easy to transport and install in tight spaces.

As with any thermal–heat sink, proper installation and maintenance are important for optimal performance. Good installation practices include attaching the brackets correctly, making sure the thermal fins are clean and free of debris, and using thermal paste where needed. Regular cleaning and maintenance will help the sink to operate at optimal efficiency, and prevent premature failure due to overheating.

The ATS-10B-82-C3-R0 is an excellent choice for applications where heat dissipation is required. With its simple design, easy installation, and efficient heat dissipation, it is an ideal solution for protecting devices and components from overheating.

The specific data is subject to PDF, and the above content is for reference

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