ATS-10B-87-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-10B-87-C1-R0-ND

Manufacturer Part#:

ATS-10B-87-C1-R0

Price: $ 3.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X20MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10B-87-C1-R0 datasheetATS-10B-87-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.13866
30 +: $ 3.05361
50 +: $ 2.88401
100 +: $ 2.71435
250 +: $ 2.54470
500 +: $ 2.45987
1000 +: $ 2.20541
Stock 1000Can Ship Immediately
$ 3.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 13.13°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-10B-87-C1-R0 is an industrial thermal component typically used in heat sink applications. Thermal management components like this one are crucial in ensuring that heat generated in electronics is rapidly transferred away from electrical components which may be sensitive to high temperatures. Over time, this helps to maintain high system reliability and helps to extend product life.

This particular component is designed to be a light and compact heat sink suitable for applications with limited space. It uses the latest in heat absorption designs and works to efficiently transfer heat away from heatsensitive areas. The use of aluminum and copper construction, as well as a highly efficient heat pipe design, allows the sink to be incredibly lightweight and highly effective in heat transfer.

The ATS-10B-87-C1-R0 is a thermal solution designed specifically for densely packed electronics and high power applications. It has the capability to adjust performance appropriately for different loads with its wide range of adjustable fan speed settings. This ensures high performance in the most demanding applications. The low profile design also provides the user with the flexibility to mount the component in tight positions.

The device also features a heat pipe direct-touch technology that allows it to absorb heat more quickly and efficiently. This is done by having cupper tubes directly in contact with the heat source, allowing heat to transfer quickly and with minimal resistance. The fins on the heat sink are also carefully designed to create maximum air flow and deliver the best cooling performance.

The ATS-10B-87-C1-R0 is an ideal thermal device for applications with limited space and high loads. It is also perfect for applications where low noise levels are paramount. Moreover, it allows users to take advantage of the latest heat transfer technologies delivering the highest performance in the smallest package.

The specific data is subject to PDF, and the above content is for reference

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