| Allicdata Part #: | ATS-10B-90-C3-R0-ND |
| Manufacturer Part#: |
ATS-10B-90-C3-R0 |
| Price: | $ 4.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10B-90-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.95577 |
| 30 +: | $ 3.73611 |
| 50 +: | $ 3.51628 |
| 100 +: | $ 3.29654 |
| 250 +: | $ 3.07677 |
| 500 +: | $ 2.85700 |
| 1000 +: | $ 2.80206 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks are designed for transferring heat away from heat-sensitive components in electrical and electronic devices. Heat Sinks offer the advantage of both reducing the operating temperature of circuitry and allowing dissipated heat to be conducted away from sensitive components. The ATS-10B-90-C3-R0 Heat Sink is an example of a device built for this purpose. It is designed specifically to provide a high thermal performance and reliable operation in a wide range of applications.
The ATS-10B-90-C3-R0 Heat Sink is a high-efficiency, low-cost heat-dissipation device. It is constructed from an aluminum alloy material with a zinc-plated steel mounting bracket. It has been designed for optimal thermal performance in a wide variety of applications. The Heat Sink utilizes a unique extruded design with integral fins to maximize heat transfer and increase surface area.
The ATS-10B-90-C3-R0 Heat Sink is suitable for a variety of applications, including heat-sensitive components found in computers, medical imaging equipment and industrial controllers. It is also suitable for use in harsh environments, such as those found in aerospace and military applications. Its efficient design and superior heat dissipation properties make it ideal for high-power applications.
The ATS-10B-90-C3-R0 Heat Sink works by absorbing and dissipating the heat generated by components. Heat is conducted away from the heat-generating device by heat-conductive fins, which increase the surface area of the Heat Sink, allowing it to dissipate heat more quickly. Heat is then dissipated into the surrounding environment.
The ATS-10B-90-C3-R0 Heat Sink offers excellent thermal performance in a wide range of applications. It is designed to be reliable and durable and is compatible with a variety of mounting configurations. Its efficient design and superior heat-transfer capabilities make it ideal for a wide range of applications. It is an excellent choice for any application requiring reliable heat dissipation.
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