| Allicdata Part #: | ATS-10C-06-C1-R0-ND |
| Manufacturer Part#: |
ATS-10C-06-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10C-06-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.15°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-10C-06-C1-R0 thermal-heat sink is an industrial-grade device designed to provide exceptional cooling of electrical components or microprocessors. It is an excellent choice for any application that requires a cool and efficient heat sink. The device’s design is simple and straightforward, allowing for an easy installation and minimal maintenance.
The ATS-10C-06-C1-R0 is constructed with an aluminum base and copper fins. The fin design provides a high level of thermal dispersion and low thermal resistance. The copper fins are designed to disperse heat quickly and efficiently, even in high-temperature applications. The aluminum base is designed to withstand high temperatures and is also corrosion-resistant. The device also features an innovative pin design, which allows for a secure mounting and easy removal.
The ATS-10C-06-C1-R0 is designed for use in a variety of industrial and consumer applications including automotive, industrial control, telecommunications, and general purpose cooling. The device can be used to cool electronic components such as transistors, resistors, capacitors, and integrated circuits. The device can also be used to cool microprocessors or other heat-sensitive components. The thermal-heat sink is ideal for applications that require a fast, efficient, and reliable cooling solution.
The ATS-10C-06-C1-R0 features a working principle known as “Transpired Air Heat Sinks”. This type of technology relies on the combination of forced air and convection to create superior cooling capabilities. The aluminum base acts as a heat sink and provides efficient and direct heat transfer. The copper fins act as evaporators, allowing the hot air to be cooled by the surrounding air. The effect is more efficient and powerful cooling than a conventional fan and heat sink combination.
The ATS-10C-06-C1-R0 is designed for long-term, reliable operation in harsh environments and can be used in a wide range of temperatures. The device can be mounted to a flat surface or used in an enclosed space, such as an electrical enclosure. The device also features an adjustable fan speed, which can be set to provide the desired cooling performance for any application. In addition, the device includes an adjustable operating voltage, allowing for an easy installation in any environment.
The ATS-10C-06-C1-R0 offers excellent performance and reliability, making it an ideal choice for any application where effective heat dissipation is needed. The device’s design is simple and straightforward, and its range of features and adjustable settings makes it an ideal choice for any industrial or consumer application. The device is well-suited for cooling a wide variety of electronic components and microprocessors for improved performance and reliability.
The specific data is subject to PDF, and the above content is for reference