| Allicdata Part #: | ATS-10C-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-10C-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10C-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an important part of any electronic device because they help keep the components from overheating. ATS-10C-10-C3-R0 is a heat sink that\'s designed for maximum performance in high-heat applications. It\'s made from aluminum and features an optimized fin design that increases surface area for improved thermal dissipation. The heat sink also features an internal heat spreader, which helps evenly distribute the thermal load across the entire fin surface to reduce hot spots.
The purpose of using a heat sink in an application is to improve heat transfer away from the device, and the ATS-10C-10-C3-R0 does just that. With its robust aluminum construction, it is able to efficiently dissipate the heat generated by the device, thus helping to keep it running cool and prolong its lifespan.
The ATS-10C-10-C3-R0 is designed to be used in many different areas, from industrial and military to automotive and commercial. It is versatile enough to function in a myriad of applications, from communications to computing and general purpose. Its size and profile make it a great option for applications where tight spaces are a factor. Additionally, the heat sink is designed to be used in high-humidity environments, making it ideal for environments with inadequate air circulation.
At the core of the ATS-10C-10-C3-R0 is its working principle, which is thermal conduction. Thermal conduction occurs as the heat generated by the device is dissipated through the heat sink\'s aluminum fins and spreader. The fins and spreader have been designed to maximize surface area for improved heat transfer, and as a result, heat is quickly and efficiently pulled away from the device. The result is reduced component temperatures, which helps to increase the longevity of the device.
The ATS-10C-10-C3-R0 is a high-performance thermal solution for a range of applications. Its optimized design helps to ensure maximum thermal transfer and performance. Its size and profile make it ideal for tight spaces, while its resilient construction helps it withstand high-humidity environments. Finally, its working principle of thermal conduction helps to maximize its heat dissipation capabilities, making it an invaluable tool for keeping devices running cool and prolonging their lifespan.
The specific data is subject to PDF, and the above content is for reference