ATS-10C-12-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-10C-12-C1-R0-ND

Manufacturer Part#:

ATS-10C-12-C1-R0

Price: $ 3.48
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10C-12-C1-R0 datasheetATS-10C-12-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.16197
30 +: $ 3.07671
50 +: $ 2.90581
100 +: $ 2.73489
250 +: $ 2.56397
500 +: $ 2.47851
1000 +: $ 2.22211
Stock 1000Can Ship Immediately
$ 3.48
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.84°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important part of any electrical or electronic system and heat sinks play a crucial role in reducing heat levels and preventing component malfunction and failure. As such, the ATS-10C-12-C1-R0 Thermal-Heat Sink is a commonly used solution for thermal management requirements in modern electronic systems and applications. This article details the application field and working principle of the ATS-10C-12-C1-R0 heat sink.

The application field of the ATS-10C-12-C1-R0 heat sink is quite versatile, given the product’s high level of performance and stability. It is suitable for use in a wide range of industrial, commercial, scientific and other applications which require efficient heat dissipation. Circuits with lower power requirements, such as discrete components or integrated circuits can all benefit from the application of the ATS-10C-12-C1-R0 heat sink. The product can also be used in other applications such as automotive, defense and medical, as well as consumer electronics.

In terms of its working principle, the ATS-10C-12-C1-R0 heat sink concentrates thermal energy away from its substrates, including integrated circuits and other components, with the help of conduction and convection. Through conduction, the device efficiently transfers thermal energy away from the substrate through direct contact. The convective mechanism employs air movement to effectively remove heat away from the substrates. In this way, the ATS-10C-12-C1-R0 heat sink dissipates tremendous amounts of thermal energy which would otherwise negatively affect the performance of its electronic components.

The ATS-10C-12-C1-R0 heat sink features an optimized design composed of fin patterning approved by internationally renowned organizations. The fin patterning ensures that the least possible thermal energy is lost during the process of heat dissipation. The device also includes an advanced contact system which helps ensure that each thermal surface is effectively connected, resulting in maximal heat transfer and optimal thermal performance. Overall, the ATS-10C-12-C1-R0 heat sink offers a reliable and efficient thermal management solution.

The ATS-10C-12-C1-R0 Heat Sink represents a powerful solution for a wide array of industrial, commercial, scientific and other applications. It efficiently and effectively dissipates thermal energy away from its substrates through conduction and convection, making it one of the most reliable and efficient thermal management components available. Its optimized fin patterning and advanced contact system ensures a maximal heat transfer and optimally perform thermal operations. With its highly reliable thermal performance, the ATS-10C-12-C1-R0 Heat Sink is a perfect choice for sectors that require precise and efficient thermal management.

The specific data is subject to PDF, and the above content is for reference

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