| Allicdata Part #: | ATS-10C-133-C3-R0-ND |
| Manufacturer Part#: |
ATS-10C-133-C3-R0 |
| Price: | $ 6.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10C-133-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.77206 |
| 30 +: | $ 5.45118 |
| 50 +: | $ 5.13047 |
| 100 +: | $ 4.80986 |
| 250 +: | $ 4.48920 |
| 500 +: | $ 4.16855 |
| 1000 +: | $ 4.08839 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a type of passive heat exchanger that circulates heat away from an object, such as a processor. The thermodynamics involved in heat sink technology is that heat is generated by a source, typically electricity, and this energy is in the form of heat. Heat sinks are used to dissipate this heat to the surrounding air by using conduction, convection and radiation.
The ATS-10C-133-C3-R0 heat sink is made from aluminum with a black anodized finish. It features a slim 33mm height, 133mm length and 54mm width. It also includes finned dissipative surface structure that allows for greater thermal transfer and efficient cooling. It is a thermal dissipation product specifically engineered to meet the high performance requirements of various electronic components.
The primary purpose of the ATS-10C-133-C3-R0 heat sink is to transfer the heat generated by the components in a system to the air, thereby cooling the parts and preventing the system from overheating. It has a well-designed structure to maximize the heat dissipation while also maintaining a low profile. The dissipation surface of the heat sink features an array of fins, which allow for high thermal transfer efficiency and allow the air to circulate and cool the components in the system.
The ATS-10C-133-C3-R0 heat sink works by transferring heat through an interface known as a thermal bridge. This bridge connects two conductive materials, such as an Aluminum base and finned top surface of the heat sink. It works by as the heat from the electronics components are transferred to the heat sink, the structure will then dissipate the heat out to the surrounding air. As the air temperature increases, it becomes more active in convection and the flow of the air promotes a cooling effect on the components.
The ATS-10C-133-C3-R0 is a heat sink designed for various power module applications, such as those in the telecommunications and IT industries. It is ideal for cooling high speed processors, graphics cards, switches, routers and more. Additionally, it has a wide temperature range and is equipped with a very reliable thermal coefficient, making it an ideal choice for all types of electronic components.
In conclusion, the ATS-10C-133-C3-R0 heat sink is a reliable and efficient cooling component designed for power module applications. It features an aluminum anodized finish with a slim 33mm height, 133mm length, 54mm width and a finned dissipative surface structure that allows for greater thermal transfer and efficient cooling. With its wide temperature range and reliable thermal coefficient, the ATS-10C-133-C3-R0 can help keep the system running at optimal temperatures even when it is under heavy strain.
The specific data is subject to PDF, and the above content is for reference