| Allicdata Part #: | ATS17348-ND |
| Manufacturer Part#: |
ATS-10C-141-C2-R0 |
| Price: | $ 3.76 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10C-141-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.42090 |
| 10 +: | $ 3.32892 |
| 25 +: | $ 3.23870 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.71°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a crucial aspect of many modern electronic devices, ranging from computers and cell phones to motors, electric heaters, and medical equipment. Heat sinks are a popular solution in many applications to safely dissipate heat away from a device, allowing it to run smoothly and without the risk of thermal shutdowns or damage to sensitive components. The ATS-10C-141-C2-R0 Heat Sink is a prime example of an effective and reliable heat sink available on the market today.
The ATS-10C-141-C2-R0 Heat Sink is a direct contact finned, all-aluminum to chassis mounted unit designed with airflow optimization in mind. The heat sink stands tall at a total length of 120mm and features ten elliptical blades designed to reduce turbulence levels. The fan itself is composed of a black anodized aluminum housing, and its optimized fan design provides a maximum noise rating of only 16dB.
The ATS-10C-141-C2-R0’s application field is wide, including a variety of heating and cooling configurations employed in electric motor control, robotics, and other applications. The unit is particularly suited for applications in which compact size and low noise are key requirements. In addition, the ATS-10C-141-C2-R0 meets the challenges of high-performance overclocking, networked and high-load electronics, military chassis platforms, and numerous other industries.
The ATS-10C-141-C2-R0’s working principle is fairly straightforward. The unit is designed to dissipate heat away from the device where it is mounted. This is accomplished by utilizing the unit’s internal fins, which act as a heat spreader by drawing heat away from the device’s components. The heat is then transferred to the ATS-10C-141-C2-R0’s housing and to the ambient air. The heat sink also utilizes airflow to help displace the heat across the fins, allowing the unit to maximize its cooling capabilities and further reduce the risk of thermal shutdowns or damage for the device.
In conclusion, the ATS-10C-141-C2-R0 Heat Sink is a highly effective and reliable piece of thermal management equipment capable of successfully cooling applications in all corners of the industrial market. The unit’s impressive cooling capabilities and low noise profile make it an ideal thermal solution for high-performance applications, and its compact design allows for easy installation without sacrificing performance. By leveraging its direct contact finned design, airflow optimization, and ability to dissipate heat away from devices, the ATS-10C-141-C2-R0 Heat Sink ensures that all of its customers’ applications are reliably cooled, allowing them to perform optimally and always ready for action.
The specific data is subject to PDF, and the above content is for reference