| Allicdata Part #: | ATS-10C-145-C1-R0-ND |
| Manufacturer Part#: |
ATS-10C-145-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10C-145-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a crucial factor for many industrial and consumer applications. Heat sinks, as an important part of thermal management, are used to efficiently dissipate heat generated by integrated circuits (ICs), processors, and other sources of heat.
The ATS-10C-145-C1-R0 is a particular type of heat sink from the ALLTOM series of heat sinks manufactured by ATS. It is designed to efficiently dissipate heat from high-powered ICs in a limited space. The heat sink combines advanced technology, precision engineering, and fine construction to achieve its high performance. It is capable of dissipating heat at temperatures up to 145 Celsius with its anodized aluminum fins that are precision-machined to exacting technical specifications.
The ATS-10C-145-C1-R0 is specifically designed for use in consumer electronics, such as laptops, tablets, smartphones, and gaming systems. It is also suitable for use in commercial and industrial applications, such as in medical imaging, power management, and other high-powered systems. With its versatile design and reliable performance, it is an ideal choice for applications where thermal management is critical to the product\'s success.
The ATS-10C-145-C1-R0 features a pin-fin design that maximizes air flow and disperses heat more efficiently. It also features a highly durable powder coating on its surface for added protection against corrosion, as well as a two-stage alloyed processing that provides excellent thermal characteristics. Additionally, the heat sink is equipped with a high-performance ceramic base which provides increased thermal conductivity and improved adhesive strength.
The ATS-10C-145-C1-R0 operates on the principle of forced convective air cooling. This operates by using fans to draw in ambient air, which is then passed over the heat sink\'s fins. This causes a cooling effect, dissipating the heat from the heat sink and the ICs, and maintaining the ICs within its optimum temperature range. The fins are designed to increase the total surface area, allowing maximum heat dissipation. Additionally, the heat sink is designed in such a way that air is optimally passed over its fins, which minimizes the airflow resistance and further increases its cooling performance.
Overall, the ATS-10C-145-C1-R0 is a well-designed heat sink that is suitable for a wide range of applications requiring effective thermal management. With its durable construction, high-performance design, and versatile versatility, it is an ideal choice for a variety of thermal management needs.
The specific data is subject to PDF, and the above content is for reference