| Allicdata Part #: | ATS17355-ND |
| Manufacturer Part#: |
ATS-10C-148-C2-R0 |
| Price: | $ 4.03 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10C-148-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.66030 |
| 10 +: | $ 3.56265 |
| 25 +: | $ 3.36470 |
| 50 +: | $ 3.16676 |
| 100 +: | $ 2.96881 |
| 250 +: | $ 2.77089 |
| 500 +: | $ 2.57297 |
| 1000 +: | $ 2.52349 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.59°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks have long been used to reduce the temperature of electronic components and systems. The ATS-10C-148-C2-R0 is an advanced example of such a heat sink. It is a combination heat sink and air heatsink assembly designed to be used in high-temperature electronic applications.
The ATS-10C-148-C2-R0 heat sink is composed of a base plate, aluminum fins, a mounting bracket and an end cap. The base plate is constructed of high performance aluminum with a grid pattern designed for enhanced heat conduction. The fins are made of aluminum with a black anodized finish, and are arranged in a staggered pattern to provide maximum contact surface area with the heat source. The mounting bracket, which is made of steel, attaches the heat sink to a mounting surface securely.
The ATS-10C-148-C2-R0 heat sink is typically used in applications where high temperature components need to be cooled. For example, semiconductors, microprocessors, power supplies, fan controllers, and other high power electronics are all common applications. In such applications, the heat sink helps to draw heat away from hot components and spread it over a larger surface area, thus reducing the temperature of the component and preventing damage due to overheating.
The heat sink’s heat transfer is achieved through a combination of conduction and radiation. The aluminum fins are designed to efficiently conduct heat away from the heat source and into the ambient air. In addition, the fins act as a thermal radiation surface, dissipating the heat generated by the component into the surrounding environment.
In addition to its primary purpose of cooling, the ATS-10C-148-C2-R0 has other benefits. It has a wide temperature range from -55°C to +125°C, making it suitable for a variety of applications. The fins also provide the heat sink with structural stability and airflow that further improves its performance. The ATS-10C-148-C2-R0 is also designed for easy installation and relatively low maintenance.
The ATS-10C-148-C2-R0 is an ideal choice for a wide range of high-temperature applications. Its effective thermal management solution ensures that components remain cool and prevents overheating, allowing them to operate more reliably and for a longer period of time. In addition to providing excellent thermal performance, the ATS-10C-148-C2-R0 is also easy to install, has a wide temperature range, and requires minimal maintenance.
The specific data is subject to PDF, and the above content is for reference