ATS-10C-16-C3-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are devices designed to absorb and dissipate heat from electronic components, such as processors, graphics cards, and even semiconductors. The ATS-10C-16-C3-R0 is a type of heat sink designed to effectively manage thermal energy in a variety of applications. This heat sink features a heatsink fin design, which helps to increase the surface area available for thermal dissipation. Additionally, its vertical fins add another layer of thermal dissipation, increasing the total amount of energy the heat sink can dissipate.

The ATS-10C-16-C3-R0 is composed of a base, which is made of aluminum, and a heat sink fin, which is made of extruded aluminum. This combination of materials makes the heat sink particularly suitable for applications requiring high thermal conductivity. Additionally, the heat sink is equipped with two heat pipes, which are designed to facilitate the quick movement of heat away from sensitive components. This heat pipe design helps to improve the overall thermal performance of the heat sink.

The ATS-10C-16-C3-R0 heat sink is capable of cooling a wide range of components, from CPUs and GPUs to RAM and other electronic components. Its performance is further enhanced by its easy-to-use installation procedure, which requires minimal setup time. The heat sink\'s fin design also ensures that the temperature of the components is more even, thereby improving the overall thermal performance of the system.

The ATS-10C-16-C3-R0 heat sink serves a number of different applications, ranging from cooling PC components to providing reliable cooling for small server and embedded systems. Its base has a relatively large size, which allows for the heat sink to fit in most enclosures, while its vertical fins provide additional thermal performance. Additionally, its heat pipe design ensures that heat is quickly and efficiently dissipated away from sensitive components, thus reducing the load on the system\'s fans.

The ATS-10C-16-C3-R0\'s working principle is based on two key factors: first, its aluminum base conductivity, which absorbs and transfers away heat from electronic components. Second, its extruded aluminum fin design creates an exchange of heat between the fins themselves, thus increasing thermal efficiency. These two factors combined give the ATS-10C-16-C3-R0 its outstanding thermal performance, making it a reliable and dependable solution for both PCs and small-scale embedded systems.

In conclusion, the ATS-10C-16-C3-R0 is a heat sink designed to provide effective thermal dissipation in a variety of applications. Its aluminum base and plenty of fins provide excellent thermal conductivity, while its two heat pipes ensure that heat is quickly and efficiently removed from sensitive components. All of these features, combined with its easy installation, make the ATS-10C-16-C3-R0 a reliable and dependable solution for computer and embedded systems alike.

The specific data is subject to PDF, and the above content is for reference