| Allicdata Part #: | ATS-10C-170-C1-R0-ND |
| Manufacturer Part#: |
ATS-10C-170-C1-R0 |
| Price: | $ 3.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10C-170-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.04353 |
| 30 +: | $ 2.96100 |
| 50 +: | $ 2.79657 |
| 100 +: | $ 2.63208 |
| 250 +: | $ 2.46758 |
| 500 +: | $ 2.38533 |
| 1000 +: | $ 2.13857 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.02°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management technology has seen vast improvements over the past few decades, allowing electronic systems to operate in increasingly challenging environments. ATS-10C-170-C1-R0 is an advanced thermal heat sink that is designed to provide the cooling capacity needed to safely dissipate heat from sensitive electronic components, while managing conduction or convection. This heat sink is manufactured with a lightweight aluminum alloy that is able to operate in dynamic temperature conditions, providing superior thermal management performance.
The ATS-10C-170-C1-R0 heat sink provides a very efficient heat dissipation rate, with an efficient aluminum base that is able to absorb heat quickly and efficiently, as well as dissipate it. The heat sink features a 0.39 inch OD aluminum frame with internal channels that are designed to provide maximum heat conduction. These channels are also perfect for electric components as they provide a secure mounting point for the necessary components.
The ATS-10C-170-C1-R0 also features a top grill, designed to increase the overall air flow. This increases the heat sink’s overall thermal transfer rate, allowing for faster and more efficient cooling. In addition to the aluminum frame, the heat sink also features an inner tube and cover assembly, which helps to direct and regulate the air flow around the components, ensuring a maximum thermal transfer rate. This reduces the risk of overheating and performance loss.
The ATS-10C-170-C1-R0 heat sink is ideal for use in industrial power supplies, electronic systems, and more extreme applications where higher air flow is required. This advanced thermal management design provides the necessary cooling capacity needed to safely dissipate heat from sensitive electronic components, making it an ideal choice for advanced thermal management applications. The enhanced airflow also helps to keep components safe from the risks of overheating.
As the heat dissipation rating of the ATS-10C-170-C1-R0 heat sink is excellent, it is suitable for use in a variety of different electrical and electronic systems. This includes LED lighting systems, automated systems, medical devices, and computers. Moreover, this particular heat sink model is capable of operating at temperatures ranging from 0°C to 150°C, which is why it is so useful in extreme thermal conditions.
The ATS-10C-170-C1-R0 heat sink has been designed to offer the highest level of performance in thermal management applications. The combination of aluminum frame and advanced internal channels ensures the highest level of efficiency when transferring heat away from the components. This makes the ATS-10C-170-C1-R0 an ideal choice for advanced thermal management systems, as it provides the necessary cooling capacity needed to safely dissipate heat from sensitive components, while also managing conduction or convection.
The specific data is subject to PDF, and the above content is for reference