| Allicdata Part #: | ATS-10C-173-C3-R0-ND |
| Manufacturer Part#: |
ATS-10C-173-C3-R0 |
| Price: | $ 3.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10C-173-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.44673 |
| 30 +: | $ 3.25542 |
| 50 +: | $ 3.06394 |
| 100 +: | $ 2.87242 |
| 250 +: | $ 2.68093 |
| 500 +: | $ 2.48943 |
| 1000 +: | $ 2.44156 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are used in a variety of applications to keep systems running at optimal temperatures. One of the most widely used thermal management heat sinks is the ATS-10C-173-C3-R0. This heat sink is designed to dissipate heat generated by electronic circuitry and can be used to effectively cool both low and high power devices.
The ATS-10C-173-C3-R0 is designed for attaching to a variety of components such as CPUs, GPUs, and LED drivers. The heat sink has a lightweight and compact nature, making it ideal for applications where there is minimal space or airflow. It is also constructed with a heavy-duty aluminum which ensures good thermal conductivity.
The ATS-10C-173-C3-R0 heat sink features pin fins which helps produce maximum cooling performance. The pin fins act to provide greater surface area over which the heat can be dissipated. By increasing the surface area, the fins help to increase air flow and thermal transfer which helps to transfer the heat away from the circuitry. The fins also work to create turbulence in the air which helps to further dissipate the heat.
The ATS-10C-173-C3-R0 heat sink can also be used to passively cool devices without the need for fans or other active cooling devices. The passive cooling capacity of the heat sink is more than sufficient in most applications and eliminates the need for a fan or other air-moving device.
In addition to the passive cooling capacity, the ATS-10C-173-C3-R0 heat sink also has an extruded aluminum body that is designed to draw heat away from the device. The body utilizes a combination of radiative and convective heat dissipation technology to effectively disperse the heat. The heat sink is also designed to be compatible with a variety of components so that it can be easily integrated into existing systems.
The ATS-10C-173-C3-R0 heat sink is one of the most efficient and reliable thermal management heat sinks on the market today. It is designed for easy installation and can dissipate heat quickly and effectively. As a result, it is an ideal choice for applications where effective thermal management is required.
The specific data is subject to PDF, and the above content is for reference