ATS-10C-186-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.77°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-10C-186-C1-R0

The ATS-10C-186-C1-R0 is a thermal-heat sink designed and manufactured by ATS Temprite Corporation. It is used to transfer heat from components or devices within an enclosure or system for improved performance and reliability. This type of sink helps to maintain optimal temperatures in enclosures or systems by providing effective heat dissipation. It is designed to fit in a variety of enclosures and applications, and is capable of dissipating up to 600 watts of heat.

Application Field

The ATS-10C-186-C1-R0 thermal-heat sink has a wide range of uses in a variety of industries, including telecommunications, defense, automotive, and medical technology. Due to its superior performance and reliability, it is a popular choice for a variety of applications.In the telecommunications industry, it is used to maintain a consistent temperature in both indoor and outdoor applications. It can be used to cool radio communication equipment as well as other telecommunications components. Its superior thermal management capabilities help to ensure that there is minimal signal distortion caused by heat. The ATS-10C-186-C1-R0 is also used widely in defense and aerospace applications due to its excellent heat dissipation capabilities. It is capable of maintaining temperatures within a range that ensures that sensitive components remain functional in all conditions. It is used extensively in aircraft, military vehicles, and guns.In the automotive industry, the ATS-10C-186-C1-R0 is used in a variety of applications. It is used to help regulate temperatures within the engine, ensuring that the engine remains at optimal operating temperatures and that it continues to perform efficiently. It is also used in climate control systems, ensuring that interior temperatures are maintained in all conditions.The ATS-10C-186-C1-R0 is also used in medical technology, such as in ultrasound scanners and digital radiography. It helps to ensure that the temperature within the system remains constant, making it more effective in detecting abnormalities and providing accurate images.

Working Principle

The ATS-10C-186-C1-R0 uses a passive cooling system to transfer heat away from components or devices within an enclosure or system. It consists of a heat sink chassis, an array of fins, and a fan. The heat sink chassis is designed to fit in a variety of enclosures and applications, and is capable of dissipating up to 600 watts of heat. The array of fins acts as a heat sink, transferring heat away from the components or devices within the enclosure or system. Heat is transferred away through convection, a process in which the air surrounding the enclosure is used to absorb the heat from the components or device. This process of heat transfer helps to maintain optimal temperatures within the enclosure or system.The fan, which is contained within the heat sink chassis, helps to increase the rate of heat dissipation. The fan works by drawing air through the heat sink fins, cooling them as it passes through. This further increases the rate of heat transfer away from the components or devices, ensuring that optimal temperatures are maintained in all conditions.

Conclusion

The ATS-10C-186-C1-R0 is a thermal-heat sink designed and manufactured by ATS Temprite Corporation. It is designed and used to transfer heat away from components or devices within an enclosure or system, and is capable of dissipating up to 600 watts of heat. The ATS-10C-186-C1-R0 is a popular choice for a variety of industries, such as telecommunications, defense, automotive, and medical technology. It uses a passive cooling system to transfer heat away from components or devices within an enclosure or system, which consists of a heat sink chassis, an array of fins, and a fan. This helps to ensure that optimal temperatures are maintained in all conditions.

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