ATS-10C-198-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.472" (12.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.21°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction to ATS-10C-198-C3-R0 Thermal-Heat Sinks

Thermal-heat sinks are a widely used component in many electronic products. The ATS-10C-198-C3-R0 is a thermal-heat sink that has gained popularity among manufacturers and engineers due to its reliable performance, long-lasting durability, and easy installation. In this article, we will discuss the application fields of ATS-10C-198-C3-R0 and its working principle.

Applications of ATS-10C-198-C3-R0 Thermal-Heat Sinks

ATS-10C-198-C3-R0 thermal-heat sinks are designed to dissipate heat away from a device or other component that produces or absorbs heat. This makes it a useful component in industries such as telecommunications, smart computing, embedded systems, and power management systems. It can easily be incorporated into circuit boards, including those used in industrial machinery, to help keep them cool during operation.Due to the heat sink’s slim size and lightweight construction, it can also be used in a wide variety of consumer electronics, including mobile phones, tablets, laptops, and even televisions. It works to ensure the device does not overheat while it’s running, thus ensuring better performance and longer life span of the components within it.

Working Principle of ATS-10C-198-C3-R0 Thermal-Heat Sinks

At its most basic, the working principle of a thermal-heat sink is the transfer of heat away from the component that is generating it. The ATS-10C-198-C3-R0 thermal-heat sink works by using its heat dissipating fins to draw heat away from the component and dissipate it away into the surrounding environment.The ATS-10C-198-C3-R0 is designed with a special Thermal Connectivity ‘X’ Beam Core, which is responsible for better heat dissipation and lower thermal resistance. This core is made up of a combination of high-performance aluminum and copper, which are excellent heat conductors that work efficiently at transferring heat away from the component.The ATS-10C-198-C3-R0 also comes with a specialized heat-sink frame, which is designed to allow for easy installation and easy connection to the component. It is constructed of durable materials, such as aluminum and steel, and is designed to be corrosion and abrasion-resistant, as well as vibration proof.In addition, the ATS-10C-198-C3-R0 thermal-heat sink has a high-performance LED lighting system for added visibility. This system is designed to increase the efficiency of the heat transfer process further, as well as provide an extra layer of safety when using the thermal-heat sink in areas with limited visibility.

Conclusion

The ATS-10C-198-C3-R0 thermal-heat sink is a widely used component that is designed to dissipate heat away from components and other electronic items. Its Thermal Connectivity ‘X’ Beam Core, heat-sink frame design, and LED lighting system provides excellent heat dissipation and make it easy to install, making it a reliable and durable choice for industries and consumers alike.

The specific data is subject to PDF, and the above content is for reference