ATS-10C-20-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-10C-20-C1-R0-ND

Manufacturer Part#:

ATS-10C-20-C1-R0

Price: $ 3.99
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10C-20-C1-R0 datasheetATS-10C-20-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.62061
30 +: $ 3.41922
50 +: $ 3.21817
100 +: $ 3.01701
250 +: $ 2.81588
500 +: $ 2.61474
1000 +: $ 2.56446
Stock 1000Can Ship Immediately
$ 3.99
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.13°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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A thermal heat sink is a device used to dissipate excess heat from electronic components or systems. Heat sinks are commonly used in laptops, servers, and other high-powered electronics, where heat from the components must be efficiently managed. The ATS-10C-20-C1-R0 is a heat sink designed to be used in applications with high thermal requirements.

The ATS-10C-20-C1-R0 is an advanced thermal solution that has been designed for use in environments that have restricted space available and where demands are high for effective thermal control. It features a two-part chassis design which reduces the number of components required and provides a self-contained cooling solution. The base of the ATS-10C-20-C1-R0 is made from aluminum alloy and the upper cover is made from stainless steel. In addition, the ATS-10C-20-C1-R0 uses a fan to improve the thermal performance.

The ATS-10C-20-C1-R0 is designed to effectively dissipate heat from high-power processors and other sensitive electronic components. It is designed to dissipate heat more rapidly than traditional heat sinks, reducing the risk of component failure due to overheating. The ATS-10C-20-C1-R0 has a high resistance to corrosion and can be used in harsh environments.

The working principle of the ATS-10C-20-C1-R0 is based on conduction and convection. Conduction is the process of transferring heat energy by direct contact between molecules. The ATS-10C-20-C1-R0 features a large aluminum base which acts as a heat spreader, allowing for efficient transfer of heat from the processor or other component to the air. Convection is the process of transferring heat energy from one place to another through the movement of liquids or gases. The ATS-10C-20-C1-R0 includes a fan which creates airflow over the heatsink, allowing for efficient transfer of heat to the air.

In addition, the ATS-10C-20-C1-R0 features low thermal resistance, meaning it is able to expel more heat from the system without the need for a higher-powered fan. The ATS-10C-20-C1-R0 is also designed to reduce vibration, ensuring that the system operates quietly and efficiently.

The ATS-10C-20-C1-R0 has a wide range of applications, ranging from server room cooling to gaming consoles. Its efficient thermal management makes it suitable for use in workstations, high-end graphic cards, and many other thermal demanding components. The device is also ideal for cooling high-powered CPUs and GPUs, providing the same level of performance and reliability as a larger cooler.

The ATS-10C-20-C1-R0 is a reliable and efficient thermal solution for high-performance applications. Its design ensures that it effectively dissipates excess heat generated by CPUs and other components, while its fan helps reduce vibration and noise levels. The device is also built using high-quality materials, making it resistant to corrosion and suitable for use in harsh environments.

The specific data is subject to PDF, and the above content is for reference

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