| Allicdata Part #: | ATS-10C-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-10C-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10C-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a crucial consideration in today’s modern electronics industry and is essential when designing circuits and components to be used in high power or high-temperature applications. Heat sinks are an integral part of this process and are often used to help dissipate heat away from the system elements, preventing damage and providing the necessary cooling effect. The ATS-10C-20-C3-R0 is one such product from a company called Sanyo. This heat sink is highly effective at conducting thermal energy and comes with a variety of features that makes it a great choice for many kinds of systems.
The ATS-10C-20-C3-R0 is primarily designed for use in applications where a high amount of heat must be dissipated from system elements. It is a high-end heat sink that features a unique fin and clip design. The fins act as an efficient heat dissipating surface, allowing the product to effectively conduct thermal energy away from the connected component. The clips act as a bridge between the fins, providing an interface between the heat sink and the circuit board. This allows for an easy and secure connection with no additional hardware being required.
When it comes to performance, the ATS-10C-20-C3-R0 is highly efficient. Its fins are constructed with highly conductive materials, allowing it to dissipate heat quickly and reliably. Additionally, the clips provide a secure connection and help to maintain a good thermal bond between the heat sink and the system element. The product also features a very small footprint, making it ideal for applications where space is limited.
In terms of installation, the ATS-10C-20-C3-R0 is quite easy to use. The product comes in an assembly format, so all the user has to do is attach the clips to the system element and then press the fins into the clips to secure the thermal bridge. The product is also designed to be flexible, allowing users to adjust the fins to fit their particular application - a feature that is especially useful for systems with varying thermal requirements.
The ATS-10C-20-C3-R0 is a great product for thermal management applications. It has an efficient fin and clip design that allows for reliable and effective heat dissipation and a small footprint that makes it ideal for use in crowded systems. Additionally, the product is very easy to install, making it an excellent choice for both novice and experienced users alike. With its combination of excellent performance and ease of use, the ATS-10C-20-C3-R0 is sure to be a popular choice for a variety of thermal management applications.
The specific data is subject to PDF, and the above content is for reference