ATS-10C-29-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-10C-29-C1-R0-ND

Manufacturer Part#:

ATS-10C-29-C1-R0

Price: $ 6.83
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X20MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10C-29-C1-R0 datasheetATS-10C-29-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 6.14187
30 +: $ 5.80083
50 +: $ 5.45958
100 +: $ 5.11831
250 +: $ 4.77709
500 +: $ 4.43586
1000 +: $ 4.35056
Stock 1000Can Ship Immediately
$ 6.83
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.56°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks are devices used to transfer the heat generated by a variety of electrical and electronic equipment into the surrounding environment, thus providing cooling. The ATS-10C-29-C1-R0 thermal heat sink is designed to perform this task in a highly efficient manner. This article will explain the application field and working principle of the ATS-10C-29-C1-R0.

The application field of the ATS-10C-29-C1-R0 is primarily used for cooling of electrical and electronic devices in consumer and industrial environments. The heat sink can be used in a variety of applications, including computers, laptops, gaming consoles, electronic devices, and refrigeration and air conditioning systems. The heat sink is designed to dissipate the thermal energy generated by these devices and other components in an efficient manner, without the need for additional cooling fans or mechanical cooling.

The working principle of the ATS-10C-29-C1-R0 thermal heat sink is quite simple. The device consists of a base that is connected to the main heat-generating device or component, and a series of metal fins that extend out from the base. The fins act as radiators, allowing the thermal energy generated by the device to be dissipated into the environment. The fins create an area with increased surface area, which increases the rate of conduction and convection of the heat away from the device.

In order to maximise the effectiveness of the ATS-10C-29-C1-R0 thermal heat sink, it is important to ensure that the fins are spaced evenly apart, and the spacing between the fins is equal. The spacing between the fins helps to maximise the amount of thermal energy that can be dissipated, while also allowing for airflow around the fin surfaces. Additionally, it is important to ensure that there are no air gaps between the base and the fins, as this will reduce the efficiency of the heat sink.

The ATS-10C-29-C1-R0 thermal heat sink is designed for use in a wide range of applications. In computers, laptops, and gaming consoles, the thermal heat sink can be used to help prevent overheating of components, while in refrigeration and air conditioning systems, it can help to maintain ideal temperatures. Additionally, the ATS-10C-29-C1-R0 is also designed for use in a variety of other applications, including solar water heaters, air compressors, and other types of electrical and electronic equipment.

Due to its highly efficient design, the ATS-10C-29-C1-R0 thermal heat sink can provide reliable cooling performance, even in harsh or extreme temperatures. Additionally, the heat sink can last for many years with minimal maintenance, and does not require the use of additional cooling fans or mechanical cooling systems. Therefore, the ATS-10C-29-C1-R0 is an ideal solution for the cooling of electrical and electronic components in a variety of commercial and industrial environments.

The specific data is subject to PDF, and the above content is for reference

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