| Allicdata Part #: | ATS-10C-42-C3-R0-ND |
| Manufacturer Part#: |
ATS-10C-42-C3-R0 |
| Price: | $ 7.03 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X22.86MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10C-42-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.32709 |
| 30 +: | $ 5.97555 |
| 50 +: | $ 5.62401 |
| 100 +: | $ 5.27253 |
| 250 +: | $ 4.92103 |
| 500 +: | $ 4.56953 |
| 1000 +: | $ 4.48166 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are essential components in the cooling system of electrical devices. The ATS-10C-42-C3-R0 is an aluminum-based, water-cooled heat sink designed for heat dissipation and air flow optimization in a range of applications.
The ATS-10C-42-C3-R0 is ideal for use in systems where the cooling element must be mounted close to the system components. The heat sink is designed to take advantage of its natural air flow characteristics and optimized thermal impedance. The ATS-10C-42-C3-R0 features a unique honeycomb-style grid pattern that maximizes heat dissipation and air flow.
The ATS-10C-42-C3-R0 is designed for use in a variety of applications, including electronics cooling, data center cooling, telecommunications systems, and automotive electronics. The unique geometry and aluminum construction offer superior performance, allowing for maximum heat dissipation and air flow optimization.
The ATS-10C-42-C3-R0 has a thermal impedance (RI) of 0.08°C/W, meaning that it quickly and effectively dissipates heat from a variety of electronics components. The high thermal impedance ensures maximum performance in any application. The heat sink utilizes a unique fin design that is optimized to dissipate heat effectively and minimize air turbulence. The combination of its aluminum construction and fin layout ensures maximum efficiency in heat dissipation.
The ATS-10C-42-C3-R0 also features a unique connector layout that allows for maximum air flow. The connectors are arranged in a radial pattern, which optimizes air circulation and reduces turbulence. This radial pattern also allows for maximum contact with the heat sink, thereby ensuring that heat is dissipated effectively and uniformly.
The ATS-10C-42-C3-R0 also features a multi-stage fin design. This design reduces air turbulence and ensures maximum heat dissipation. The multi-stage fin design is also used to maintain a constant pressure gradient between the inside and outside of the heat sink. This ensures consistent cooling of different components in the system, resulting in improved performance.
In addition, the ATS-10C-42-C3-R0 features a large surface area. The large surface area provides a greater surface for heat transfer, allowing for more efficient cooling of different components in the system. The large surface area also allows for maximum contact with the heat sink, ensuring that heat is dissipated efficiently.
The ATS-10C-42-C3-R0 has a low profile design, allowing for easy installation in different applications. The unique design of the heat sink also includes a removable aluminum base plate. This allows for easy mounting and removal of the heat sink from a system.
Overall, the ATS-10C-42-C3-R0 is an ideal solution for cooling system applications where space and weight is limited. Its unique design and aluminum construction ensure maximum performance and air flow optimization, making it an ideal solution for applications such as electronics cooling, data center cooling, telecommunications systems, and automotive electronics.
The specific data is subject to PDF, and the above content is for reference