| Allicdata Part #: | ATS-10C-53-C3-R0-ND |
| Manufacturer Part#: |
ATS-10C-53-C3-R0 |
| Price: | $ 4.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10C-53-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.63195 |
| 30 +: | $ 3.43014 |
| 50 +: | $ 3.22837 |
| 100 +: | $ 3.02665 |
| 250 +: | $ 2.82487 |
| 500 +: | $ 2.62310 |
| 1000 +: | $ 2.57265 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.76°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are important components in a wide range of electronic products. They are primarily responsible for dissipating large amounts of heat generated from electronic circuits and components. ATS-10C-53-C3-R0 is a leading thermal - heat sink from Altech Corporation that offers superior performance in challenging applications. This article will discuss the application field and working principle of ATS-10C-53-C3-R0 in detail.
Application Field: ATS-10C-53-C3-R0 thermal - heat sink has been extensively used where cooling is essential and critical for the operational efficiency of electronic circuits and components. This includes PCs, high-power amplifiers, lasers, power transistors, electronic circuits, LED cooling, medical and industrial electronics, and consumer electronics. ATS-10C-53-C3-R0 offers excellent heat transfer and conduction with a low profile, making it ideal for use in tight spaces and applications where space is limited.
Working Principle: ATS-10C-53-C3-R0 heat sink works on the principle of heat conduction. It consists of one or more elongated channels made of either aluminum or copper. Each fin is designed to increase the surface area of the heat sink by creating thermal ridges that radiate more heat away from the components and electronic circuits. The heat is then dissipated from the surface of the sink into the surrounding air via convection. The fins also act as an airfoil, helping the air to flow more efficiently over the heat sink, thus improving heat dissipation.
In addition to its excellent conduction and convection capabilities, ATS-10C-53-C3-R0 also features a low profile design that makes it perfect for applications where space is limited. The design allows for a high degree of heat transfer efficiency with a minimum amount of space. This makes it ideal for use in dense, compact electronic configurations.
ATS-10C-53-C3-R0 thermals - heat sink is also highly efficient and durable. Its aluminum or copper channels are able to withstand high temperatures and stresses, and its surface is coated with a protective finish to prevent oxidation or corrosion. Additionally, ATS-10C-53-C3-R0 comes with a variety of mounting options to fit most applications. This helps to ensure easy installation and secure and reliable heat dissipation.
Overall, ATS-10C-53-C3-R0 thermal - heat sink is an excellent choice for a wide range of thermal applications. It is highly efficient, durable, low profile, and easy to install. It is also capable of handling high temperatures and stresses with ease, making it perfect for the most demanding applications. With its superior performance and features, ATS-10C-53-C3-R0 is the ideal solution for your heat sink needs.
The specific data is subject to PDF, and the above content is for reference