| Allicdata Part #: | ATS17457-ND |
| Manufacturer Part#: |
ATS-10C-66-C2-R0 |
| Price: | $ 4.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10C-66-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.51710 |
| 10 +: | $ 4.39551 |
| 25 +: | $ 4.15120 |
| 50 +: | $ 3.90701 |
| 100 +: | $ 3.66282 |
| 250 +: | $ 3.41863 |
| 500 +: | $ 3.17444 |
| 1000 +: | $ 3.11340 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.77°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal solutions are integral parts of any electrical system. Heat sinks are used to absorb and dissipate heat, created by the electrical components in a system. The most efficient and economical thermal solution is a heat sink or a device designed to dissipate the maximum amount of heat from the surface of an electrical component with the minimum expenditure of energy. The ATS-10C-66-C2-R0 is a common type of heat sink, designed to optimize the heat transfer from electrical components.
The ATS-10C-66-C2-R0 heat sink is a two-stage, pin-fin design with built-in conductive thermoplastic. This allows for the efficient suspension of heat, generated by electronic components under continuous high wattage. The design also provides a level and secure mounting platform and improved cooling efficiency.
The device is made up of two stages of cooling fins, both made from highly conductive thermoplastic and insulated to minimize the amount of energy required to transfer the heat away from the components. The first stage of fins is designed to capture the heat generated by the electrical components and transfer it to the second stage of fins. The second stages of fins then dissipates the heat away from the component by conduction of air around the fins.
The ATS-10C-66-C2-R0 heat sink is suitable for use in many different applications with varying levels of electrical energy output and performance requirements. It can be used in consumer electronics, such as laptops and phones, to provide a level of cooling efficiency. It can also be used in high-end electronics, such as routers and servers, to provide a more efficient form of cooling. The device is also used extensively in automotive applications, such as engine control units and power inverters.
The ATS-10C-66-C2-R0 heat sink is a reliable and proven thermal solution, designed to provide optimal performance and maximum cooling efficiency in a wide range of applications. With its pin-fin design and built-in thermoplastic, the device can provide a reliable and secure mounting platform for any electrical component. Furthermore, by providing a more efficient way of dissipating the heat away from the components, the device can help improve the overall performance of electrical systems.
The specific data is subject to PDF, and the above content is for reference