ATS-10C-88-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS17479-ND

Manufacturer Part#:

ATS-10C-88-C2-R0

Price: $ 4.13
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X25MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10C-88-C2-R0 datasheetATS-10C-88-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.75480
10 +: $ 3.65526
25 +: $ 3.45215
50 +: $ 3.24904
100 +: $ 3.04592
250 +: $ 2.84286
500 +: $ 2.63980
1000 +: $ 2.58903
Stock 1000Can Ship Immediately
$ 4.13
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.11°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal Heat Sinks are designed to dissipate the generated heat that is produced as a result of electrical and mechanical processes in a wide variety of applications. The ATS-10C-88-C2-R0 Thermal Heat Sink is a particularly effective heat sink that offers good thermal performance for a wide range of applications, including computers, telecommunications, industrial equipment, and military applications.

The ATS-10C-88-C2-R0 Thermal Heat Sink is constructed of a unique alloy of aluminum and copper that creates a resilient and robust structure. It consists of a series of carefully designed fins that maximize surface area, increasing the heat transfer rate, while maintaining a low profile with minimal protrusion. It also has an anodized finish which helps to reduce environmental stress, further enhancing its durability.

The working principle of the ATS-10C-88-C2-R0 Thermal Heat Sink is based on the the process of natural convection. The air-cooled device works by leveraging the natural heat transfer process known as convection. The heat is generated by the electrical and mechanical elements within the equipment. This heat is then transferred to the fins of the heat sink, which in turn disperse the heat into the surrounding air. The convection process continues to cycle as long as the heat-generating components remain in operation.

The ATS-10C-88-C2-R0 Thermal Heat Sink is an excellent choice for a variety of applications, such as cooling CPUs, GPUs, and other Electronics. It is also suitable for applications such as communication equipment, industrial equipment, and other products that require effective thermal management. In addition, it is an ideal solution for high-power and high-heat industrial applications, as it can handle temperatures of up to 375°F (190°C).

The ATS-10C-88-C2-R0 Thermal Heat Sink is designed to effectively distribute the heat generated by the electrical and mechanical elements within the product, and efficiently disperse the heat into the surrounding environment. The anodized coating and well-engineered fins and fins shape ensure that the system can handle extremely high temperatures, while remaining resistant to physical and environmental stress.

Ultimately, the ATS-10C-88-C2-R0 Thermal Heat Sink is a great choice for thermal management in a wide range of applications. It offers an exceptional level of reliability and excellent thermal performance, making it an ideal solution for computers, telecommunications, industrial equipment, and military applications. Additionally, its robust structure and effective design make it a great choice for high-powered and high-temperature industrial applications.

The specific data is subject to PDF, and the above content is for reference

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