| Allicdata Part #: | ATS-10D-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-10D-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10D-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-10D-10-C1-R0 is a type of heat sink which is used for cooling purposes in electronic applications. It is part of the Thermal - Heat Sinks category of cooling systems. These sinks provide effective thermal management, making them suitable for high-performance applications. The ATS-10D-10-C1-R0 is constructed from lightweight aluminum, providing superior heat dissipation and a low profile that helps minimize device footprint in constrained spaces. This heat sink also comes with various features, such as a built-in CPU thermal interface material, two fan mounting positions, and thermal pads for better heat dissipation.
In order to understand how the ATS-10D-10-C1-R0 works, it is important to understand the basics of thermodynamics. When heat is applied to an object, it causes molecules in the object to increase in energy. These higher energy molecules move faster, meaning they take up more space and produce pressure. This pressure, known as thermal pressure, is what causes objects to expand and can also cause them to emit energy in the form of heat. Heat sinks use this principle to absorb and dissipate heat away from components.
The ATS-10D-10-C1-R0 is designed to absorb and disperse this heat efficiently. The aluminum construction allows for better heat movement and dissipation, allowing more efficient cooling. Heat is absorbed by the thermal interface material and transferred to the fins of the sink. The fins allow for increased air contact and help dissipate the heat. Heat is then released into the surrounding environment, keeping components from overheating.
The ATS-10D-10-C1-R0 can be used in a variety of applications, from small consumer electronics to large industrial equipment. Its lightweight design makes it suitable for mobile applications, while its low profile allows for installation in tight spaces. The included fan mounting positions and thermal pads further increase the heat sink’s cooling capabilities, making it ideal for both low-power and high-performance applications. These features make the ATS-10D-10-C1-R0 an ideal choice for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference