| Allicdata Part #: | ATS-10D-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-10D-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10D-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management in modern electronics is a major challenge. Heat generated by electrical components must be efficiently dissipated to prevent component failure or overheating. A heat sink is a device designed to absorb and dissipate heat from electrical components in applications such as computers and other electronic devices. The ATS-10D-10-C3-R0 is a thermal heat sink designed for high efficiency heat dissipation from electronic components and devices.
The ATS-10D-10-C3-R0 is a finned heat sink that utilizes an aluminum design with a copper core. Its fin array is arranged in a folded configuration that allows for maximum surface area and increased airflow. This allows for increased heat transfer rate from components to the surrounding environment. The fins are further configured into an array of cooling “towers” that are designed to maximize air flow and create a “plenum” for additional cooling. The fins are treated with a die cast aluminum coating to increase their thermal conductivity, enabling them to absorb more heat. The core of the ATS-10D-10-C3-R0 contains a maze of copper “ribs” that are designed to direct heat away from the components and to the fins, where it is dissipated into the surrounding environment.
The ATS-10D-10-C3-R0 is designed to be used in a wide variety of applications. Its foldable design makes it ideal for use in small, tight spaces. Its large heat dissipation capabilities make it ideal for use in high performance computer components and devices such as CPUs, GPUs, and other high-end electronics. It can also be used to cool small-area receptacles, as well as small cooling fans.
The ATS-10D-10-C3-R0 is designed to be used in multiple applications and offers unparalleled cooling performance. Its folded fin array allows for increased air flow and increased heat transfer from components to the surrounding environment. Its die cast aluminum coating increases its thermal conductivity, and its unique internal ribbing increases its relay of heat away from components. The ATS-10D-10-C3-R0 offers an efficient and reliable solution for the thermal management needs of modern electronics.
The specific data is subject to PDF, and the above content is for reference