ATS-10D-107-C3-R1 Allicdata Electronics
Allicdata Part #:

ATS-10D-107-C3-R1-ND

Manufacturer Part#:

ATS-10D-107-C3-R1

Price: $ 4.94
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X40X9.5MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10D-107-C3-R1 datasheetATS-10D-107-C3-R1 Datasheet/PDF
Quantity: 1000
10 +: $ 4.44150
30 +: $ 4.19496
50 +: $ 3.94808
100 +: $ 3.70138
250 +: $ 3.45462
500 +: $ 3.20786
1000 +: $ 3.14617
Stock 1000Can Ship Immediately
$ 4.94
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.969" (50.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.374" (9.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 28.03°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-heat sinks are essential components in electronics. By transferring heat from its source to the surrounding air, they help regulate the temperature of the device and avoid potential system damage. One of the most popular and widely used heat sinks on the market today is the ATS-10D-107-C3-R1. This article will analyze its application field and working principle.

The ATS-10D-107-C3-R1 is designed for high-end applications such as power systems and industrial computing, where the need for superior heat dissipation is paramount. It is composed of a high-efficiency heat-conductive coated aluminum base and a thin fin-type heat sink. The aluminum base features a unique fin-type design that ensures effective cooling performance, while the thin fin-type heat sink and improved thermal conductivity provide optimal cooling for the device. Furthermore, the device comes with a side wall mounting clip that allows it to be easily mounted and removed when needed.

The working principle of the ATS-10D-107-C3-R1 is based on a process known as thermal dynamics. This process involves the transfer of heat from the device into the surrounding air. The aluminum base serves as a heat exchanger, absorbing the heat generated by the device and transferring it outwards. This process is enhanced by the fin-type heat sink, which increases the surface area of the device exposed to the surrounding air. This enables more efficient and effective heat transfer out of the device, resulting in improved cooling efficiency.

The ATS-10D-107-C3-R1 is an ideal heat sink for high-end applications, providing superior performance and reliability. With its robust design and improved thermal transfer ability, this device is capable of withstanding extreme temperatures and dissipating heat quickly and efficiently. Furthermore, the device is cost-effective and can help reduce the electricity costs associated with cooling systems. By keeping the device’s temperature at a consistent and optimal level, it ensures smooth operation of the system.

In conclusion, the ATS-10D-107-C3-R1 is a powerful and reliable heat sink that is ideal for high-end applications. With its robust design and efficient thermal transfer ability, it is capable of dissipating large amounts of heat quickly and efficiently. Furthermore, the device is cost-effective and can reduce the overall electricity cost associated with cooling systems. As such, it is an essential component of any device that requires efficient thermal management.

The specific data is subject to PDF, and the above content is for reference

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