ATS-10D-110-C3-R1

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important aspect of any critical application, and Thermal - Heat Sinks are one of the most common components used to efficiently transfer, store, and dissipate heat away from sensitive electronic components. The ATS-10D-110-C3-R1 is a popular aluminum Heat Sink designed for demanding applications. This article will discuss the application field and working principle of the ATS-10D-110-C3-R1.

The ATS-10D-110-C3-R1 is designed to provide efficient cooling for LED lighting, power supplies, computers, and a wide variety of other electronic devices. It is especially suited for applications where a large amount of direct contact heat sink is required. The ATS-10D-110-C3-R1 features a high-quality, two-stage anodized aluminum construction and reliable riveted design. It also features a black matte finishing, which provides corrosion resistance and superior thermal conductivity. The heat sink also includes an exothermic adhesive insulator that ensures the sink is securely attached to the device it is cooling.

The ATS-10D-110-C3-R1 is designed with an efficient working principle to dissipate heat from electronic components. Heat is generated from devices that use electrical power, and it is important to transfer the heat away from the device to keep it working at optimum efficiency. The heat sink works by transferring the heat away from the device it is cooling through a process called thermodynamics. This process involves removing heat from one point and spreading it evenly throughout the heat sink.

The ATS-10D-110-C3-R1 is also designed with a finned design. The finned design allows for greater surface area of contact with the air, which increases the dissipation of heat. The finned design is beneficial as it provides more efficient convection of heat away from the component it is cooling. Additionally, the fins also act as a barrier between the heat and the surrounding area, preventing heat radiation from occurring.

In addition, the ATS-10D-110-C3-R1 also features a variety of different mounting options to suit a variety of applications. The heat sink can be mounted in a vertical or horizontal orientation, and the mounting brackets have adjustable mounting holes to allow for secure and convenient installation. The mounting brackets also feature four different colored mounting options, allowing for easy identification of the correct mount for the device.

To sum up, the ATS-10D-110-C3-R1 is a high-quality heat sink designed for use in a variety of demanding applications. The unique finned design of the heat sink increases the surface area of contact with air, allowing for superior heat dissipation. The heat sink also features an exothermic adhesive insulator to ensure the secure attachment to the device it is cooling, and the various mounting options provide increased flexibility for different applications. With its reliable construction and efficient working principle, the ATS-10D-110-C3-R1 is an ideal choice for applications where heat transfer is essential.

The specific data is subject to PDF, and the above content is for reference