ATS-10D-139-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.03°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks
Heat sinks are an important factor in the cooling of electrical components, such as microprocessors, and other electronic devices. Heat sinks capture and dissipate heat, helping to keep devices from overheating and burning out. Generally, the better the heat sink, the better it is able to disperse the heat. The ATS-10D-139-C1-R0 is a high-performance heat sink that is widely used in electronic devices. In this article, we will discuss the application field and working principle of the ATS-10D-139-C1-R0.
Application Field
The ATS-10D-139-C1-R0 is an ideal heat sink for many types of electrical components. It is particularly suited for high performance applications, such as those found in computers, embedded systems, power supplies, audio amplifiers, communications systems, and industrial controls. This particular heat sink has been designed to be used with a wide variety of components, including high-performance CPUs, GPUs, FPGAs, and memory chips. It can even be used to cool more general-purpose components.
Working Principle
The ATS-10D-139-C1-R0 uses the principle of thermal conduction to dissipate heat. Heat is generated inside the device and needs to be dissipated in order to keep it operating efficiently and safely. The heat sink is designed to absorb the heat from the component and then pass it on to a fin or cooling fan, which then dissipates the heat into the surrounding environment. The fin is usually made from aluminum or copper, which is highly conductive, allowing it to quickly transfer the heat to the fan. On the top of the heat sink is a heat spreader, which distributes the heat evenly over the surface, allowing it to be dissipated quickly.
The ATS-10D-139-C1-R0 also utilizes heat pipes to further increase the efficiency of heat dissipation. Heat pipes are hollow tubes filled with a liquid that is capable of absorbing heat and transferring it to the other end of the pipe. As the heat is absorbed at one end, a fan at the other end draws the heat away from the device, helping to keep it cool. With the use of heat pipes, the heat is quickly and evenly distributed, ensuring that the device does not overheat.
The ATS-10D-139-C1-R0 also features a number of other features that make it an ideal choice for cooling applications. For example, it utilizes highly efficient thermal compound to create a good thermal bond between the heat sink and the component, ensuring that the heat is efficiently conducted away from the component. It also has a unique clip-locking design that allows easy installation and removal, reducing the risk of damaging the component while installing the heat sink. Additionally, the ATS-10D-139-C1-R0 is resistant to corrosion, providing a long-lasting and reliable cooling solution.
In conclusion, the ATS-10D-139-C1-R0 is an advanced heat sink that is designed to provide reliable and efficient cooling for electrical components. It features an advanced design that includes heat pipes, clip-locking installation, and highly conductive materials such as aluminum. It is designed to be used with a wide range of components, making it a versatile choice for many applications. With its combination of features, the ATS-10D-139-C1-R0 is an excellent choice for keeping electronic devices cool and reducing the risk of overheating and component failure.

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