ATS-10D-152-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-10D-152-C3-R0-ND

Manufacturer Part#:

ATS-10D-152-C3-R0

Price: $ 4.13
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X35MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10D-152-C3-R0 datasheetATS-10D-152-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.74787
30 +: $ 3.53934
50 +: $ 3.33119
100 +: $ 3.12304
250 +: $ 2.91483
500 +: $ 2.70663
1000 +: $ 2.65458
Stock 1000Can Ship Immediately
$ 4.13
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.46°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks have been used since the 1970s for current and voltage regulation, but only recently have they been used for thermal management. Thermal management is the process of controlling temperature within a system to ensure its maximum performance. By improving a device\'s thermal management, a wide range of applications can be achieved with greater reliability, lower cost, and improved performance. The ATS-10D-152-C3-R0 is a popular thermal management tool used in larger systems, and it is specifically designed for thermal-sensitive applications. In this article, we will discuss the application field and working principle of the ATS-10D-152-C3-R0.

The ATS-10D-152-C3-R0 is a two-piece heat sink that is designed for high-speed, high-current applications. The two pieces are a thermal absorber plate and a thermal conductor plate. The thermal absorber plate consists of a metal core substrate and two aluminum plates. The thermal conductor plate is made of an aluminum fin structure with a copper base. These two pieces work together to efficiently manage the thermal load of the system. The thermal absorber plate absorbs the heat from the components, and the thermal conductor plate dissipates the heat into the surrounding environment. This design allows for increased efficiency in the thermal management of the system.

The ATS-10D-152-C3-R0 is used in larger thermal management systems because it can provide better thermal performance than single-piece heat sinks. This makes it an ideal choice for applications that require high current and high speed operation. It is also well-suited for systems with large power consumption, such as data centers, servers, and communications networks. Additionally, the ATS-10D-152-C3-R0 can be used for medical equipment, automotive electronics, and consumer electronics, due to its efficient thermal management.

The working principle of the ATS-10D-152-C3-R0 is based on the concept of thermal conduction. When heated, the thermal absorber plate absorbs the heat from the components and transfers it into the thermal conductor plate. The thermal conductor plate then dissipates the heat into the surrounding environment. This process helps to maintain a lower temperature within the system and to better manage the thermal load.

In addition to its use in larger thermal management systems, the ATS-10D-152-C3-R0 is also used in smaller applications. It has been used to improve the thermal performance of video game consoles, wearable technology, and digital signage. In these instances, the heat sink helps to keep the device cooler while providing greater power efficiency.

The ATS-10D-152-C3-R0 is an efficient and reliable thermal management tool that can be used in a variety of applications. It has a two-piece design that allows for greater thermal performance compared to single-piece models, and it can be used in larger systems or smaller applications. By using this heat sink, engineers can help ensure maximum performance and reliability in their designs.

The specific data is subject to PDF, and the above content is for reference

Latest Products
VHS-45

HEATSINK HALF BRICK ALUM BLACKHeat Sink ...

VHS-45 Allicdata Electronics
MHST15055

HEATSINK 2.36L X1.4"H EXTRUSIONHeat Sink...

MHST15055 Allicdata Electronics
MHST10055

HEATSINK 2.36L X.94"H EXTRUSIONHeat Sink...

MHST10055 Allicdata Electronics
PH3-300-300-0.21-1A

IR HEAT SPREADER/EMITTER W/ADHHeat Sink ...

PH3-300-300-0.21-1A Allicdata Electronics
132-11B9

HEATSINK EXTRUDEDHeat Sink

132-11B9 Allicdata Electronics
413F

HEATSINK POWER TO-3Heat Sink

413F Allicdata Electronics