| Allicdata Part #: | ATS-10D-16-C3-R0-ND |
| Manufacturer Part#: |
ATS-10D-16-C3-R0 |
| Price: | $ 4.11 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10D-16-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.73590 |
| 30 +: | $ 3.52842 |
| 50 +: | $ 3.32098 |
| 100 +: | $ 3.11340 |
| 250 +: | $ 2.90584 |
| 500 +: | $ 2.69828 |
| 1000 +: | $ 2.64639 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal–Heat Sinks are widely used in modern day electronics and and other device applications. The proliferation of higher powered processors and devices with large amounts of integrated memory has posed a challenge to the manufactures of these modern day electronics who must find ways to dissipate heat generated by the devices. The ATS-10D-16-C3-R0 Heat Sink has been developed to address this need in electronic systems.
The ATS-10D-16-C3-R0 Heat Sink is designed to fit over and provide cooling to a standard Intel processor with an area of up to 10 square inches. It features a combination of die-cast aluminum with extruded aluminum fins and includes a copper heat spreader. The heat spreader works to disperse the heat from the processor into the surrounding fins, which are designed to provide optimum airflow for maximum heat dissipation. The heat is then dissipated into the environment, keeping the processor from overheating.
The ATS-10D-16-C3-R0 Heat Sink features three heat sink plates, each of which joins with the extruded heat sink fins to form a complete air-cooled solution. The copper heat spreader is located on top of the processor and works to increase surface area, allowing for maximum thermal transfer. The unique design of the heat spreader also ensures that there is no need for extra contact points, meaning there is no need to add extra screws or other mounting hardware.
In addition to dissipating heat using air flow, the ATS-10D-16-C3-R0 Heat Sink also features a special support system to reduce noise and vibration. This system uses four steel support arms that are attached to the main body of the heat sink and are designed to absorb and dissipate vibrations and sound resulting from the processor\'s fan. This system also helps to reduce wear on the processor\'s fan, as it is not exposed to direct contact with the copper heat spreader and heat sink fins.
The ATS-10D-16-C3-R0 Heat Sink is designed for use in any device application, from small embedded systems to desktop computers. With its combination of precision engineering, optimized air cooling, and noise reduction, it is the perfect solution for any modern day electronics heat dissipation needs. The support system ensures that the processor is able to run at full speed with efficient air flow, with minimal noise and vibration.
The specific data is subject to PDF, and the above content is for reference