ATS-10D-167-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-10D-167-C1-R0-ND

Manufacturer Part#:

ATS-10D-167-C1-R0

Price: $ 3.12
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X20MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10D-167-C1-R0 datasheetATS-10D-167-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.82933
30 +: $ 2.75289
50 +: $ 2.60001
100 +: $ 2.44705
250 +: $ 2.29408
500 +: $ 2.21761
1000 +: $ 1.98820
Stock 1000Can Ship Immediately
$ 3.12
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.03°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a critical requirement in a wide range of applications, and heat sinks are a classic and reliable way to manage and dissipate heats from electronic components and assemblies. The ATS-10D-167-C1-R0 is a popular heat sink solution by ALIBI Thermal Solutions, widely used in a variety of applications. This article explores the application field and working principles of the ATS-10D-167-C1-R0 heat sink.

The ATS-10D-167-C1-R0 heat sink bears a compact and tight-wiinded fin arrangement. With its fin pitch of 10mm, centered on the base and contacting the base surface to increase performance, it offers decent thermal performance, with a thermal resistance of 0.072-0.077 °C/W—a calculation based on an ambient temperature of 25°C. Other measures such as the overall diameter of 93.5mm, base thickness of 0.8mm, fin height of 110mm, and total weight of 806g give a good indication of the size and weight of the heat sink.

The ATS-10D-167-C1-R0 heat sink can be used in a wide variety of applications. It is mainly used to cool components that generate heat, such as power transistors, resistors, voltage regulator ICs, and others. The heat sink can also be used to cool heat-dissipating devices such as motors, and even larger machines such as air-conditioner compressors, but these applications require the heat sink to be much larger. Additionally, it is suitable for cooling applications in medical instruments, military and aerospace components, and industrial automation.

The ATS-10D-167-C1-R0 heat sink is designed to provide excellent thermal conduction and enhanced thermal dissipation, which are largely due to its optimized design. The fins are nickel-plated to further increase thermal performance by providing a layer of corrosion protection and a low coefficient of friction, promoting heat transfer. Additionally, the device is designed with multiple ventilation systems, such as air vents, for enhanced air circulation and thermal balance. This ensures that the heat generated is efficiently dissipated out of the address, instead of being trapped inside it.

The ATS-10D-167-C1-R0 heat sink is a highly efficient and reliable solution to manage and dissipate heat. To further increase its performance, the heat sink can be connected to a fan, which helps move cool air over the heat sink fins to dissipate heat faster. Finally, the heat sink is well-built and constructed with a sturdy aluminum frame, making it an ideal heat dissipating component in applications where reliability and robustness are important.

The specific data is subject to PDF, and the above content is for reference

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