| Allicdata Part #: | ATS-10D-180-C3-R0-ND |
| Manufacturer Part#: |
ATS-10D-180-C3-R0 |
| Price: | $ 4.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10D-180-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.74787 |
| 30 +: | $ 3.53934 |
| 50 +: | $ 3.33119 |
| 100 +: | $ 3.12304 |
| 250 +: | $ 2.91483 |
| 500 +: | $ 2.70663 |
| 1000 +: | $ 2.65458 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are an essential part of any electrical system or electronic package, providing the necessary cooling to maintain functional performance. The ATS-10D-180-C3-R0has a wide application field and is primarily used for cooling applications such as Power Modules and EEPROMs. This heat sink utilizes advanced heat transfer technology to maximize cooling efficiencies and prolong component life.
The ATS-10D-180-C3-R0 is a high performance heat sink that employs a basic two-stage cooling system. This system primarily consists of a fan-shaped design that directs air in a circular pattern over a large area of the heat sink to maximize thermal transfer rates. The fan-shaped design also reduces turbulence so that air pressure can reach higher levels of air pressure without reducing cooling capability. Furthermore, the fan-shaped design minimizes overall space, making it perfect for applications in tight spaces.
In addition to the fan-shaped design, the ATS-10D-180-C3-R0 incorporates a "Direct Heat Dissipation Method" (DHDM), which is designed to reduce thermal resistance and improve thermal transfer rates. This DHDM works by providing heat sink channels that radiate outward from the core of the heat sink. These channels provide direct heat dissipation from the component area to the fins, which are set up in a vertical orientation to create more surface area and therefore more efficient thermal transfer from the component over the entire surface area of the heat sink.
The ATS-10D-180-C3-R0 also has a unique "Nano Layer Shield" heat sink coating that helps protect components from environmental elements such as dirt, dust and radiation. This coating also provides additional heat dissipation, allowing the ATS-10D-180-C3-R0 to achieve higher levels of cooling efficiency. This combined with its low air inlet resistance allows the ATS-10D-180-C3-R0 to maintain optimal performance at higher temperatures and elevated air velocities.
The ATS-10D-180-C3-R0 is an extremely versatile heat sink that can be used for a variety of applications. It is suitable for Power Modules, EEPROMs, CPUs, FPGAs, GPUs and more. In addition, the ATS-10D-180-C3-R0 is designed to offer maximum thermal transfer rates and low air inlet resistance, making it ideal for high power applications. Furthermore, its thin profile and small footprint make it the perfect solution for tight spaces. With all of these features combined, the ATS-10D-180-C3-R0 is one of the best heat sinks available on the market.
The specific data is subject to PDF, and the above content is for reference