ATS-10D-182-C2-R0

Thermal management of electronic components has become increasingly important in recent years, and heat sinks are a critical component in this process. The ATS-10D-182-C2-R0 heat sink is an example of a larger-scale solution that is designed for larger, more demanding applications. This heat sink is a great option for applications that require a very high cooling efficiency.

The ATS-10D-182-C2-R0 heat sink is an aluminum skip fin with copper insert design with a 2.98 in2 baseplate area and 18.2 in2 total active area. The fins are designed in an optimized fin pattern for maximum heat transfer, providing an effective thermal resistance of 0.164 °CW/W. Additionally, the heat sink has a profile height of 0.67 in, an assembly height of 0.95 in, and a mounting instruction size of 2 in. The heat sink is designed to work with air-cooled systems as well as larger, more complicated liquid-cooled systems when proper surface sealing is assured.

The ATS-10D-182-C2-R0 provides an advanced thermal solution by using an optimized fin layout to increase heat transfer. The dense aluminum skip-fin structure with integrated copper insert also provides enhanced heat dissipation compared to traditional heat sinks, and the fins are specifically designed to contour to the surface of electronic components for superior conduction. This heat sink offers excellent performance in terms of thermal efficiency and can help reduce system temperatures significantly.

The ATS-10D-182-C2-R0 heat sink is designed to be used in applications such as data centers, industrial automation, power electronics, and more. It is designed to meet the unique needs of these applications by providing superior thermal performance, as well as providing a small form factor for easier assembly and installation. The heat sink is also designed for easy installation with a 71-pin press fit design which ensures robust electrical contact. Additionally, the press fit design also ensures better mounting stability and a secure mechanical connection.

The working principle behind the ATS-10D-182-C2-R0 heat sink is simple: hot air rises from the base of the heat sink, and is expelled outward through the fins. This ensures that the heat generated by the electronic components is transferred away and expelled into the environment. This keeps the system temperatures within an acceptable range, thus maximizing the performance and longevity of the components.

The ATS-10D-182-C2-R0 heat sink is an effective solution for cooling larger, more demanding applications. Its optimized fin pattern increases heat transfer, its press fit design provides a secure mechanical connection and improved assembly, and its small form factor makes it suitable for a variety of applications. By providing these unique advantages, the ATS-10D-182-C2-R0 heat sink is an ideal solution for thermal management of components.