| Allicdata Part #: | ATS-10D-197-C1-R0-ND |
| Manufacturer Part#: |
ATS-10D-197-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10D-197-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.80539 |
| 30 +: | $ 2.72979 |
| 50 +: | $ 2.57809 |
| 100 +: | $ 2.42645 |
| 250 +: | $ 2.27480 |
| 500 +: | $ 2.19898 |
| 1000 +: | $ 1.97149 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a device employed to dissipate excess heat in an electrical or mechanical device. Heat sinks are generally comprised of metal components which absorb the heat and dissipate it into the surrounding environment. The ATS-10D-197-C1-R0 is a heat sink specifically designed for use in limited space applications.
The ATS-10D-197-C1-R0 heat sink is designed with a dense micro-fin fin array which allows for increased surface area and consequently increases the efficiency of heat dissipation. The combination of the densely spaced fins and the efficient interface between the air and fin surface increases the overall thermal performance.The central core of the ATS-10D-197-C1-R0 heat sink is composed of a machined aluminum base which provides direct contact with the heat source. This base is connected to the fin array via a bonding method such as soldering, epoxy adhesive, or clamping. The fin array is composed of aluminum alloy and the construction is designed to reduce the air flow resistance.
The application field of the ATS-10D-197-C1-R0 heat sink is suitable for cooling high-power LED applications, automotive electronics, IoT device applications, or other components that generate a large amount of heat and require a small form factor. It is especially useful for applications where space is at a premium because it has an extremely compact profile.
In order to maximize the thermal performance of the ATS-10D-197-C1-R0 heat sink, airflow must be taken into consideration. This heat sink works best when high air flow is applied directly across the fin array. This will ensure that the rate of heat transfer from the fins to the surrounding air is maximized. Furthermore, the fin array should be arranged so that the air flows perpendicular to the fin array for optimal efficiency.
The ATS-10D-197-C1-R0 heat sink is an excellent choice for limited space applications. It has a dense micro-fin fin array which increases the efficiency of heat dissipation, a solid aluminum core that provides direct contact with the heat source, and a fin array constructed to reduce air flow resistance. Finally, it is important to take airflow into consideration to maximize the thermal performance of the ATS-10D-197-C1-R0 heat sink.
The specific data is subject to PDF, and the above content is for reference