| Allicdata Part #: | ATS-10D-198-C3-R0-ND |
| Manufacturer Part#: |
ATS-10D-198-C3-R0 |
| Price: | $ 3.58 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10D-198-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.25710 |
| 30 +: | $ 3.16932 |
| 50 +: | $ 2.99326 |
| 100 +: | $ 2.81717 |
| 250 +: | $ 2.64109 |
| 500 +: | $ 2.55305 |
| 1000 +: | $ 2.28894 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat dissipation is one of the most important topics in the field of electronics cooling. Heat sinks, such as the ATS-10D-198-C3-R0 are designed to draw heat away from electronic components to prevent them from overheating and eventually, failure. These types of heat sinks are generally used in combination with fans and other cooling solutions in order to provide the most effective cooling possible.
The ATS-10D-198-C3-R0 is a thermal-based heat sink designed to be used for the cooling of electronics. It is made from high quality aerospace grade materials and features an innovative design specifically tailored to fit a variety of electronic applications. This heat sink is precision-machined for maximum heat transfer and offers superior performance compared to other heat sinks on the market.
In order to understand the working principle of the ATS-10D-198-C3-R0 heat sink, it\'s important to first understand the basics of heat transfer. Heat is transferred from one object or material to another by a process of thermal conduction. In other words, heat is transferred from a warmer material to a cooler material until the two at equilibrium. This is the same basic principle behind the ATS-10D-198-C3-R0 heat sink.
The ATS-10D-198-C3-R0 heat sink is designed to work by dissipating the heat produced by an electronic component or device into the air around it. This is achieved through the use of an aluminum die cast base and a series of fins formed in the top. The aluminum base acts as a conductor, while the fins act as fins radiators, allowing heat to be more effectively transferred away from the component or device. In addition, the fin-shape allows the heat to be rapidly dispersed from the area, resulting in cooler operation for the electronics.
The ATS-10D-198-C3-R0 heat sink also features an incredibly efficient heat transfer system. This system is designed to effectively transfer the heat from the component or device to the aluminum base. From there, the heat is evenly distributed amongst the fins and away from the source. This ensures that the heat produced by the component is quickly and efficiently dispersed, making the cooling system more effective and reliable.
The ATS-10D-198-C3-R0 heat sink is perfect for a variety of applications where reliable cooling and effective heat distribution is a must, such as computer systems, server rooms, and data centers. Since this heat sink can easily be integrated into existing cooling solutions, it is highly recommended for any environment where cooling is a priority.
The ATS-10D-198-C3-R0 heat sink is an excellent example of how thermal heat sinks can effectively and efficiently keep electronic components cool. With its innovative design, high quality materials, and efficient heat transfer system, this heat sink is a great choice for anyone looking for a reliable and effective cooling solution.
The specific data is subject to PDF, and the above content is for reference