| Allicdata Part #: | ATS-10D-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-10D-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10D-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for any equipment that requires protection against over-heating. The ATS-10D-20-C1-R0 is a compact and powerful heat sink designed to compound thermal management with improved CPU performance. With its ultra-low profile, sleek design, and exceptional performance, the ATS-10D-20-C1-R0 offers superior heat dissipation.
The ATS-10D-20-C1-R0 uses a revolutionary heat sink technology that incorporates several features to maximize efficiency. It is composed of a robust aluminum alloy that conducts heat efficiently and provides maximum coverage to dissipate as much heat as possible. Its ultra-low-profile design maximizes surface area in order to dissipate heat most effectively, while its folding fin heat sink structure ensures high heat dissipation rates in minimal space.
Additional features of the ATS-10D-20-C1-R0 include a patent pending heat transfer and heat dissipation system, as well as a super fin heat sink design. The innovative heat transfer and heat dissipation system ensures the optimal flow of heat away from the processor, while the super fin heat sink design provides maximum thermal coverage. Together, these features combine to provide unparalleled thermal efficiency.
In addition to its superior heat dissipation capability, the ATS-10D-20-C1-R0 also utilizes a unique flexible air flow system. This system utilizes two separate fans, one located at the top and another at the bottom of the heat sink, to direct air up and away from the processor. This enables the ATS-10D-20-C1-R0 to reduce noise and improve cooling efficiency.
This revolutionary heat sink technology, coupled with its efficient air flow system, makes the ATS-10D-20-C1-R0 an ideal choice for thermal management. Its low profile and sleek design enable it to fit seamlessly into any system, while its exceptional thermal performance provides improved CPU performance and stability. Thanks to its combination of features, the ATS-10D-20-C1-R0 is an ideal choice for any system that requires efficient thermal management.
The specific data is subject to PDF, and the above content is for reference