| Allicdata Part #: | ATS-10D-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-10D-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10D-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential component of any electronics system. Heat sinks, typically made of aluminum or copper, provide an effective way of dissipating heat away from sensitive components and allow them to function reliably and efficiently. The ATS-10D-20-C3-R0 is a widely used heat sink designed for general electronic applications.
The ATS-10D-20-C3-R0 is designed to provide maximum thermal performance by drawing heat away from the components to which it is attached. It consists of a two-piece aluminum frame with ribbed fins on the outside and thermally conductive adhesive on the inside. The design is optimized to provide efficient heat transfer rates. The fin spacing is designed to optimize air-flow, thus increasing the heat dissipation capability of the assembly. Additionally, a special tactile feature allows the ATS-10D-20-C3-R0 to be mechanically mounted to ensure a more reliable connection with the substrate.
The combination of these features yields a highly efficient heat sink with a maximum thermal resistance of 0.7°C/W. This level of thermal performance is ideal for high performance systems such as digital signal processing (DSP) or graphics processing units (GPUs). Additionally, its low profile design makes it suitable for environments with limited space.
When properly applied, the ATS-10D-20-C3-R0 can easily meet the thermal requirements of any application. For its superior performance and reasonable price, it has become one of the most popular choice for system engineers and product designers. Additionally, the assembly is RoHS compliant, making it a cost-effective and environmentally friendly solution.
In conclusion, the ATS-10D-20-C3-R0 is a cost-effective and environmentally sound heat sink solution for applications requiring thermal performance. Its low profile design and easy-to-use mounting system make it an ideal choice for designers looking for reliable thermal performance. Additionally, its compliance with RoHS requirements makes it suitable for a variety of applications and industries. With its superior performance and low cost, the ATS-10D-20-C3-R0 is sure to continue to be a popular choice for system engineers and product designers.
The specific data is subject to PDF, and the above content is for reference