| Allicdata Part #: | ATS-10D-24-C1-R0-ND |
| Manufacturer Part#: |
ATS-10D-24-C1-R0 |
| Price: | $ 4.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10D-24-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.08303 |
| 30 +: | $ 3.85623 |
| 50 +: | $ 3.62943 |
| 100 +: | $ 3.40257 |
| 250 +: | $ 3.17573 |
| 500 +: | $ 2.94889 |
| 1000 +: | $ 2.89218 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-10D-24-C1-R0 is a high-performance thermal heat sink designed for use in electronic components. It is designed to take the heat generated by these components and dissipate it quickly, without compromising the integrity of the components. The heat sink is made from aluminum alloy with good thermal conductivity and low weight, making it ideal for applications that require high-performance cooling.
It is also designed with a special fin design that increases the air flow around the heat sink and improves its efficiency. The fins act as a barrier, preventing heat from escaping and concentrating it around the heat sink. This allows more efficient cooling and therefore more efficient operation of the components that are being cooled. The fin design also enhances the durability of the heat sink and minimizes the risk of damage due to high temperatures and other environmental factors.
The ATS-10D-24-C1-R0 heat sink can be used in a variety of applications. It is especially useful in applications requiring high temperatures such as servers and power supplies for computers and other electronic components. It can also be used in large, multi-platform applications such as those found in industrial control systems and telecommunications. The heat sink is also designed for use in applications requiring high-performance cooling such as embedded systems, where it can enable more efficient operation and longer life.
The ATS-10D-24-C1-R0 heat sink works by transferring heat away from the components and to the environment. It does this by absorbing the heat from the components and then dissipating it through the fin design. The fins act as a heat sink, dissipating heat to the air in the surrounding environment. This allows the components to stay cool while still being able to perform optimally. The heat sink also reduces the risk of overheating and damage caused by excessive heat radiation.
The ATS-10D-24-C1-R0 is an excellent choice for applications requiring high-performance cooling. It is made of a strong alloy that is lightweight and has great thermal conductivity, making it ideal for small and large scale applications. It also has a special fin design that provides improved air flow and efficient cooling and is designed to withstand extreme temperatures. This makes it an ideal choice for a variety of industrial and commercial applications.
The specific data is subject to PDF, and the above content is for reference