ATS-10D-28-C3-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an essential aspect of the design of any electronic device. The heat generated by electronics must often be efficiently dissipated to avoid damage or degradation of components. Heat dissipation is also necessary to ensure the proper performance of the product. Proper thermal management requires not only efficient heat sinks but also accurate thermal analysis.The thermal analysis is useful for understanding the behavior of a given system, which can facilitate the selection of the most appropriate thermal components. To properly dissipate the amount of heat given out in a particular system, the most suitable thermal components must be chosen in order to optimize the efficiency of the system. Heat sinks are one of the most common thermal components used in electronic systems.A typical heat sink is a metallic piece that absorbs and dissipates heat from an electronic device. The heat is spread over the surface of the heat sink, where it can be dissipated into the surrounding environment. Heat sinks come in a variety of designs, including fan cooled, natural convection, and forced air cooled designs. They can also be made from a variety of materials, such as aluminum, copper, and even plastic.The ATS-10D-28-C3-R0 heat sink is a simple yet effective cooling device that is suitable for many applications. This heat sink is made from aluminum extrusion, and is designed specifically for low-power applications. The ATS-10D-28-C3-R0 heat sink features a low profile design, which means it can accommodate tight spaces and integrates easily into most assemblies. It is also designed to provide excellent thermal performance due to its large surface area and efficient heat transfer design. The fins on the heat sink provide additional surface area for thermal transfer, while the pin grid array on the top helps to increase the contact area of the heat sink to the components. This heat sink also features a layer of high-thermal-conductivity thermal tape laid on the internal surface of the heat sink, which helps to absorb and dissipate heat more efficiently.The ATS-10D-28-C3-R0 heat sink is suitable for a variety of applications requiring efficient heat dissipation without the need for an additional fan or blower. It is designed for applications with a maximum power dissipation from 0.5 Watts to 10 Watts. The heat sink is an ideal solution for battery-powered devices, such as cell phones and laptops, as it uses natural convection (heat radiation) to dissipate the heat produced by the electronics. Furthermore, its small size and low profile design make it perfect for applications in tight spaces where space is at a premium.The ATS-10D-28-C3-R0 heat sink is a simple and effective solution for many electronics-related thermal management applications. Its efficient design combines a large surface area with high-thermal-conductivity materials in order to efficiently absorb and dissipate heat more effectively than traditional designs. The included pin grid array helps to further increase the contact area between the heat sink and the components. Its small size and low profile design make it ideal for applications in tight spaces, and the natural convection design means that it can effectively dissipate heat without the need for an additional fan. This makes the ATS-10D-28-C3-R0 heat sink an ideal solution for a variety of applications requiring efficient heat dissipation.

The specific data is subject to PDF, and the above content is for reference